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NCV887740D1R2G

Onsemi

NCV887740D1R2G by Onsemi

NCV887740D1R2G by Onsemi is a current-mode switching controller with boost switcher config. It has a max switching frequency of 501 kHz, min input voltage of 2V, and nominal output voltage of 12V. Ideal for applications requiring efficient power conversion in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,614 parts In-Stock

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Digiode

USA . 1,855 parts In-Stock

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Vigor

Singapore . 415 parts In-Stock

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$1.260

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415

$1.260

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AZTECH Wire

Italy . 205 parts In-Stock

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$13.600

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205

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$24.375

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$22.181

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$19.988

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100

$24.375

$22.181

$19.988

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QUARKTWIN TECHNOLOGY LTD

USA . 16,304 parts In-Stock

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SupplyDigital Components

Austria . 6,516 parts In-Stock

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Perfect Parts

USA . 3,920 parts In-Stock

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Kulean Microsystems

USA . 1,867 parts In-Stock

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Corphita

USA . 1,652 parts In-Stock

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TANS Electronics

Latvia . 1,525 parts In-Stock

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Problanco Electronics

Mexico . 1,496 parts In-Stock

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UHIMA Technologies

Türkiye . 559 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 245 parts In-Stock

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Overview

Discover the NCV887740D1R2G by Onsemi, a cutting-edge switching regulator and controller that offers unparalleled quality and reliability. With Onsemi's expertise in semiconductor technology, this product is designed to deliver superior performance and efficiency in various applications. From automotive to industrial electronics, this versatile component provides seamless power management solutions, ensuring optimal functionality and longevity for your devices. Embrace the value and benefits of the NCV887740D1R2G, and experience the advantage of choosing a trusted manufacturer like Onsemi for all your power regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliable performance in various operating conditions.

Surface Mount: YES

Being surface mountable makes installation easier and minimizes PCB space, making it suitable for compact designs.

No. of Terminals: 8

Having 8 terminals allows for versatile connections and functionalities in the circuit design.

Control Mode: CURRENT-MODE

Current-mode control provides better transient response and improved stability, ensuring efficient power delivery.

Maximum Switching Frequency: 501 kHz

The high maximum switching frequency allows for fast response and precise control of the power delivery, making it suitable for a wide range of applications.

Nominal Output Voltage: 12 V

The nominal output voltage of 12V is standard and widely used, making it compatible with various electronic devices and systems.

Technical Specifications

Switching Regulators & Controllers NCV887740D1R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

2 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Nominal Output Voltage:

12 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

501 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCV887740D1R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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