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NCV8800SDW33

Onsemi

NCV8800SDW33 by Onsemi

NCV8800SDW33 by Onsemi is a switching regulator with 2.5A output current, operating at -40 to 125 °C. It features pulse width modulation control mode and buck switcher configuration, suitable for automotive applications due to its small outline package and high max input voltage of 16V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,068 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 554 parts In-Stock

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TANS Electronics

Latvia . 8,035 parts In-Stock

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Problanco Electronics

Mexico . 5,620 parts In-Stock

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SupplyDigital Components

Austria . 4,944 parts In-Stock

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Kulean Microsystems

USA . 3,447 parts In-Stock

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Corphita

USA . 2,207 parts In-Stock

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Microchip USA

USA . 439 parts In-Stock

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Vigor

Singapore . 261 parts In-Stock

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UHIMA Technologies

Türkiye . 254 parts In-Stock

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Corohmni

South Africa . 240 parts In-Stock

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Overview

Unlock the power of efficiency with the NCV8800SDW33 by Onsemi. Designed for automotive applications, this switching regulator offers unparalleled quality and reliability. With a compact design and advanced control techniques, it provides a seamless current/voltage-mode operation. Experience the benefits of precise power management and improved performance in a wide range of electronic systems. Trust Onsemi's expertise in switching regulators and controllers to deliver the value and advantages you need for your next project. Drive innovation and success with the NCV8800SDW33.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the regulator, making it reliable for long-term use.

Surface Mount: YES

Surface mount installation makes the regulator easy to integrate onto a circuit board, saving space and simplifying assembly.

Control Mode: CURRENT/VOLTAGE-MODE

Ability to operate in both current and voltage modes provides flexibility in regulating power output based on different requirements.

Maximum Output Current: 2.5 A

High maximum output current allows the regulator to power devices that require higher levels of current, making it suitable for various applications.

Maximum Seated Height: 2.65 mm

Low profile design with a small seated height enables the regulator to be used in space-constrained applications without compromising performance.

Technical Specifications

Switching Regulators & Controllers NCV8800SDW33 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.5 V

Nominal Input Voltage:

13.5 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

230 kHz

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

NCV8800SDW33 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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