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NCV8800HDW50G

Onsemi

NCV8800HDW50G by Onsemi

NCV8800HDW50G by Onsemi is a switching regulator with 2.5A output current, 230kHz max switching frequency, and PWM control technique. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and small outline package style. Features include 16 terminals, buck switcher config, and voltage/current-mode control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 11,832 parts In-Stock

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Digiode

USA . 974 parts In-Stock

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AZTECH Wire

Italy . 365 parts In-Stock

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$17.000

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Component Stockers USA

USA . 622 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,699 parts In-Stock

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Problanco Electronics

Mexico . 6,544 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 633 parts In-Stock

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Vigor

Singapore . 469 parts In-Stock

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Microchip USA

USA . 440 parts In-Stock

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TANS Electronics

Latvia . 386 parts In-Stock

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Corohmni

South Africa . 106 parts In-Stock

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UHIMA Technologies

Türkiye . 1 parts In-Stock

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Overview

Discover the NCV8800HDW50G by Onsemi, a cutting-edge switching regulator that guarantees top-notch performance and reliability. Manufactured by Onsemi, a renowned industry leader, this product offers unparalleled quality and durability. Ideal for a wide range of applications in automotive and industrial settings, this small outline package delivers efficient control and maximum output current of 2.5A. With a wide operating temperature range and advanced control techniques, the NCV8800HDW50G ensures optimal functionality in any environment. Upgrade your systems with this versatile and high-performance switching regulator from Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, making the product suitable for various applications.

Surface Mount: YES

Easy to mount on circuit boards, saving space and providing a streamlined assembly process.

Control Mode: CURRENT/VOLTAGE-MODE

Allows for versatile control options based on current or voltage, increasing flexibility in usage.

Nominal Input Voltage: 13.5 V

Designed for optimal performance at a specific input voltage, ensuring efficiency.

Maximum Output Current: 2.5 A

Capable of providing high output current, making it suitable for powering various components.

Control Technique: PULSE WIDTH MODULATION

Efficient control technique for regulating the output voltage, enhancing overall performance.

Technical Specifications

Switching Regulators & Controllers NCV8800HDW50G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.5 V

Nominal Input Voltage:

13.5 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

230 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

NCV8800HDW50G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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