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NCV8664ST33T3G

Onsemi

NCV8664ST33T3G by Onsemi

NCV8664ST33T3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max dropout voltage of 1.266V, suitable for applications requiring stable voltage regulation in automotive environments. It operates within a temperature range of -40 to 125°C, making it ideal for various electronic systems that demand reliable power management solutions. With a compact package style and surface-mount capability, this regulator offers efficient performance with low line and load regulation percentages.

Median Price

$1.650

Lifecycle Status

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6

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1k+

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Flip Electronics (Authorized)

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Bristol Electronics

USA . 388 parts In-Stock

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$1.650

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$1.023

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$0.825

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Vyrian

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Digiode

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Vigor

Singapore . 632 parts In-Stock

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$1.010

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Semicontronic

India . 11,565 parts In-Stock

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$2.500

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$2.438

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$2.425

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Aztec Data Supply Inc.

USA . 4,791 parts In-Stock

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$4.240

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Ampacity Inc.

Singapore . 11,502 parts In-Stock

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$9.500

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AZTECH Wire

Italy . 808 parts In-Stock

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$15.400

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Authorized Procurement Solutions

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Lixinc

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Metaverse IC Inc.

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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Kulean Microsystems

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A-Z Elektronik GmbH

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Argo Parts USA

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iodParts Technologies Inc.

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Overview

Experience the unparalleled quality and reliability of Onsemi's NCV8664ST33T3G, a top-of-the-line Fixed Regulator that guarantees superior performance in a variety of applications. With its AEC-Q100 screening level and advanced bipolar technology, this LDO regulator ensures precise voltage regulation with minimal dropout, offering customers the assurance of consistent power supply for their devices. Trust in Onsemi's expertise and innovation to deliver unparalleled value and efficiency with the NCV8664ST33T3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the regulator, ensuring a longer lifespan.

Maximum Dropout Voltage: 1.266 V

Low dropout voltage ensures efficient power conversion and minimal power loss, making this regulator ideal for applications requiring precise voltage regulation.

Surface Mount: YES

Easy to integrate into PCB designs, simplifying assembly and saving space.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Screening Level: AEC-Q100

Compliance with automotive standards ensures high quality and reliability for automotive applications.

Nominal Output Voltage: 3.3 V

Stable output voltage ensures consistent power supply to connected devices, making it suitable for sensitive electronics.

Maximum Output Current: 0.15 A

Capable of delivering sufficient current for low-power applications, providing reliable power output.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV8664ST33T3G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.266 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

45 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PSSO-G3

JESD-609 Code:

e3

Length:

6.5 mm

Maximum Line Regulation:

.025 %

Maximum Load Regulation:

.035 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Voltage Tolerance:

2 %

Width:

3.5 mm

Trade Compliance

NCV8664ST33T3G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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