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NCV8570MN330R2G

Onsemi

NCV8570MN330R2G by Onsemi

Onsemi's NCV8570MN330R2G is a BICMOS LDO regulator with 3.3V output voltage, 0.2A current, and 0.2V dropout voltage suitable for automotive applications due to AEC-Q100 screening and small form factor package. It operates at up to 150 °C, has a max input voltage of 6V, and offers excellent line regulation of 0.0112%.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 1,042 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 7,830 parts In-Stock

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TANS Electronics

Latvia . 5,873 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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Corphita

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UHIMA Technologies

Türkiye . 942 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 344 parts In-Stock

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SupplyDigital Components

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Overview

Experience the superior quality and reliability of Onsemi with the NCV8570MN330R2G fixed positive single output LDO regulator. This versatile component offers a nominal output voltage of 3.3V with a maximum dropout voltage of just 0.2V, making it ideal for a wide range of applications. With a compact package style and advanced BICMOS technology, this regulator is designed to deliver consistent performance in demanding environments. Trust Onsemi for cutting-edge technology and unparalleled value in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the regulator lightweight and durable for various applications.

Maximum Dropout Voltage: 1.2 V

Low dropout voltage ensures efficient regulation and minimal power dissipation.

Surface Mount: YES

Surface mount capability allows for easy and compact PCB assembly.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range ensures reliability in different environmental conditions.

Technology: BICMOS

BICMOS technology offers a good balance between performance and power consumption in the regulator.

Nominal Output Voltage: 3.3 V

Stable output voltage of 3.3V makes it suitable for powering various electronic components.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

As a fixed positive LDO regulator, it provides a stable output voltage with low noise and high efficiency.

Maximum Output Current: 0.2 A

Able to deliver a maximum output current of 0.2A, making it suitable for low power applications.

Maximum Input Voltage Absolute: 6 V

Supports a wide input voltage range up to 6V, allowing for flexibility in power supply selection.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV8570MN330R2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.2 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

2.2 mm

Maximum Line Regulation:

.0112 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

150 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

3.399 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

2 mm

Trade Compliance

NCV8570MN330R2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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