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NCV8502DADJG

Onsemi

NCV8502DADJG by Onsemi

NCV8502DADJG by Onsemi is an adjustable positive single output LDO regulator with a max output current of 0.15 A and a dropout voltage of 0.6 V. It operates in temperatures ranging from -40 to 150 °C, making it suitable for automotive applications requiring precise voltage regulation in a compact package.

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Lifecycle Status

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AZTECH Wire

Italy . 147 parts In-Stock

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Kulean Microsystems

USA . 6,087 parts In-Stock

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TANS Electronics

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Problanco Electronics

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Corphita

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SupplyDigital Components

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Microchip USA

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Overview

Power up your projects with the NCV8502DADJG Adjustable Regulator by Onsemi, a top-quality manufacturer in the industry. This versatile regulator offers reliable performance and precision control, making it an essential component for a wide range of applications. With its adjustable output and low dropout voltage, this LDO regulator provides exceptional value and efficiency to customers looking for superior power management solutions. Upgrade your designs with the NCV8502DADJG and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and lightweight, making it suitable for a wide range of applications.

Maximum Dropout Voltage-1: 1.6 V

The low maximum dropout voltage ensures efficient operation and minimal power loss in the system.

Surface Mount: YES

The surface mount feature allows for easy and space-saving integration into circuit boards.

Operating Temperature (TJ-Max): 150 °C

The high operating temperature range makes this regulator suitable for use in a variety of environments and conditions.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures the reliability and quality of the product, making it ideal for automotive applications.

Technology: BIPOLAR

The bipolar technology used in this regulator ensures stable and precise output voltage regulation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and secure mounting on the circuit board.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and ensures reliable connection.

Operating Temperature (TJ-Min): -40 °C

The low minimum operating temperature allows for use in extreme cold conditions without compromising performance.

Packing Method: RAIL

The rail packing method makes it convenient for handling, storage, and transportation of the regulators.

Minimum Output Voltage-1: 1.242 V

The minimum output voltage ensures compatibility with a wide range of input voltages and load requirements.

No. of Terminals: 8

The 8 terminals provide flexibility in circuit connections and ensure secure attachment to the PCB.

Maximum Line Regulation (%/V): 0.2

The low maximum line regulation ensures stable output voltage despite fluctuations in the input voltage.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact designs.

Adjustability: ADJUSTABLE

The adjustable feature allows for fine-tuning the output voltage to suit specific application requirements.

Maximum Load Regulation (%): 2.4 %

The low maximum load regulation ensures consistent output voltage even under varying load conditions.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting and space-efficient circuit layouts.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

The LDO regulator type ensures low output noise and high efficiency, making it ideal for sensitive electronic applications.

Terminal Finish: Tin (Sn)

The tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for versatile PCB mounting options and secure connections.

Maximum Output Voltage-1: 1.318 V

The maximum output voltage ensures compatibility with various voltage requirements in the system.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for slim and compact designs in space-constrained applications.

Width: 3.9 mm

The narrow width enables the regulator to be used in compact electronic devices or densely populated PCBs.

Maximum Output Current-1: 0.15 A

The maximum output current rating allows for powering a wide range of components without overheating or voltage drop issues.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and mechanical strength of the connections.

Nominal Dropout Voltage-1: 0.4 V

The low nominal dropout voltage results in minimal power dissipation and efficient regulation of output voltage.

Length: 4.9 mm

The compact length allows for flexibility in PCB layout and placement of the regulator in space-constrained designs.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCV8502DADJG attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.4 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Maximum Line Regulation (%/V):

.2

Maximum Load Regulation (%):

2.4 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

1.318 V

Minimum Output Voltage-1:

1.242 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

NCV8502DADJG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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