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NCV8501DADJR2

Onsemi

NCV8501DADJR2 by Onsemi

NCV8501DADJR2 by Onsemi is an adjustable positive single output LDO regulator with a max output current of 0.15 A and a min output voltage of 1.242 V. It operates in temperatures ranging from -40 to 150 °C, making it suitable for automotive applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,300 parts In-Stock

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Vyrian

USA . 2,161 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 464 parts In-Stock

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$0.750

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464

$0.750

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AZTECH Wire

Italy . 192 parts In-Stock

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$10.720

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$10.720

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SupplyDigital Components

Austria . 6,410 parts In-Stock

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Problanco Electronics

Mexico . 2,340 parts In-Stock

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Kulean Microsystems

USA . 2,272 parts In-Stock

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TANS Electronics

Latvia . 2,142 parts In-Stock

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Corphita

USA . 1,046 parts In-Stock

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UHIMA Technologies

Türkiye . 749 parts In-Stock

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Corohmni

South Africa . 498 parts In-Stock

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Microchip USA

USA . 394 parts In-Stock

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Overview

Experience the power of precision with the NCV8501DADJR2 by Onsemi. Known for their top-quality adjustable regulators, Onsemi delivers unrivaled performance and reliability in every product. This LDO regulator is perfect for a wide range of applications, providing exceptional voltage regulation and efficiency. Whether you're designing automotive electronics or industrial controls, this product offers superior value, efficiency, and peace of mind. Trust Onsemi to elevate your projects to new heights with the NCV8501DADJR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Maximum Dropout Voltage: 1.6 V

Low dropout voltage ensures efficient operation and minimal power loss.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on the PCB.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range allows the product to function reliably in different environments.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the product meets automotive industry standards for reliability and quality.

Technology: BIPOLAR

Bipolar technology offers stable and accurate regulation of the output voltage.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into electronic circuits.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering and reliable electrical connections.

Operating Temperature (TJ-Min): -40 °C

Low operating temperature ensures the product can function in extreme cold conditions.

Packing Method: TR

TR packing method ensures safe transportation and handling of the product.

Minimum Output Voltage: 1.242 V

Precise minimum output voltage ensures compatibility with a wide range of electronic devices.

No. of Terminals: 8

Multiple terminals allow for easy connection and integration into circuitry.

Maximum Line Regulation: 0.2%

Low line regulation ensures stable output voltage regardless of input voltage variations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact designs.

Adjustability: ADJUSTABLE

Adjustable output voltage allows for flexible use in various applications.

Maximum Load Regulation: 2.4%

Low load regulation ensures stable output voltage under varying load conditions.

Terminal Pitch: 1.27 mm

Close terminal pitch allows for compact layouts on the PCB and saves space.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

This type of regulator provides a stable and accurate output voltage for the connected circuit.

Terminal Finish: TIN LEAD

Tin lead finish on terminals ensures good solderability and prevents oxidation.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable electrical connections.

Maximum Output Voltage: 1.318 V

Precise maximum output voltage to meet the requirements of specific applications.

Maximum Seated Height: 1.75 mm

Low seated height allows for compact and space-saving designs.

Width: 3.9 mm

Narrow width saves space on the PCB and allows for compact layouts.

Maximum Output Current: 0.15 A

Sufficient output current for powering various electronic components or devices.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures reliable solder joints during manufacturing.

Nominal Dropout Voltage: 0.4 V

Low dropout voltage ensures efficient operation and minimal power loss.

Length: 4.9 mm

Compact length saves space on the PCB and allows for flexible placement.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCV8501DADJR2 attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.4 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Maximum Line Regulation (%/V):

.2

Maximum Load Regulation (%):

2.4 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

1.318 V

Minimum Output Voltage-1:

1.242 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

NCV8501DADJR2 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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