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NCV8177AMX150TCG

Onsemi

NCV8177AMX150TCG by Onsemi

NCV8177AMX150TCG by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.5A and a nominal output voltage of 1.5V. It operates in an extended temperature range from -40 to 125 °C, making it suitable for automotive applications requiring stable voltage regulation in harsh environments. The package style is small outline with very thin profile, ideal for space-constrained designs.

Median Price

$0.123

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 82 parts In-Stock

1+ parts

$0.330

100+ parts

$0.194

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82

$0.330

$0.194

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Rochester

USA . 4,000 parts In-Stock

1+ parts

-

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$0.123

1k+ parts

$0.102

10k+ parts

$0.091

4,000

-

$0.123

$0.102

$0.091

Verical

USA . 4,000 parts In-Stock

1+ parts

-

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$0.114

4,000

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$0.114

Distributors (In-Stock)

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Digiode

USA . 2,138 parts In-Stock

1+ parts

$0.116

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2,138

$0.116

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Vyrian

USA . 7,312 parts In-Stock

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7,312

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Distributors (Availability)

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Ampacity Inc.

Singapore . 67,318 parts In-Stock

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$0.104

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-

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67,318

$0.104

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Corphita

USA . 792 parts In-Stock

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$0.110

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792

$0.110

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Corohmni

South Africa . 370 parts In-Stock

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$0.122

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370

$0.122

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Component Stockers USA

USA . 177,574 parts In-Stock

1+ parts

$0.130

100+ parts

$0.120

1k+ parts

$0.110

10k+ parts

$0.110

177,574

$0.130

$0.120

$0.110

$0.110

SupplyDigital Components

Austria . 8,058 parts In-Stock

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8,058

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Problanco Electronics

Mexico . 7,741 parts In-Stock

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7,741

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Kulean Microsystems

USA . 6,167 parts In-Stock

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6,167

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TANS Electronics

Latvia . 2,894 parts In-Stock

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Microchip USA

USA . 1,264 parts In-Stock

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UHIMA Technologies

Türkiye . 273 parts In-Stock

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Overview

Experience the superior performance of the NCV8177AMX150TCG by Onsemi, a top-tier manufacturer known for its high-quality electronic components. This fixed regulator offers reliable power output with minimal dropout voltage and impressive line regulation, making it ideal for applications that demand precision and stability. From automotive to industrial use, this LDO regulator provides a seamless solution for your power management needs. Trust in Onsemi's expertise and unlock the potential of your projects with the NCV8177AMX150TCG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the regulator easy to handle and resistant to damage.

Maximum Dropout Voltage: 1.41 V

With low dropout voltage, this regulator can maintain a stable output even when the input voltage is close to the output voltage.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Operating Temperature (TJ-Max): 125 °C

The wide operating temperature range ensures the regulator can function efficiently in various environmental conditions.

Technology: CMOS

CMOS technology provides high efficiency and low power consumption, making the regulator suitable for battery-powered applications.

Nominal Output Voltage: 1.5 V

The precise output voltage ensures stable power supply for sensitive electronic components, preventing damage due to voltage fluctuations.

Maximum Output Current: 0.5 A

With a high output current capability, this regulator can power a range of components and circuits effectively.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV8177AMX150TCG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.41 V

Nominal Dropout Voltage-1:

.295 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.6 V

JESD-30 Code:

S-PDSO-N4

Length:

1 mm

Maximum Line Regulation:

.0073125 %

Maximum Load Regulation:

.01 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

1.5225 V

Minimum Output Voltage-1:

1.4625 V

Nominal Output Voltage-1:

1.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC4,.04,25

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.43 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1 mm

Trade Compliance

NCV8177AMX150TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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