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NCV8163ASN500T1G

Onsemi

NCV8163ASN500T1G by Onsemi

NCV8163ASN500T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.25A Max Output Current, and 2% Max Voltage Tolerance. It is designed for applications requiring stable voltage regulation in automotive electronics, offering AEC-Q100 screening and operating temperature range from -40 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,882 parts In-Stock

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Digiode

USA . 1,409 parts In-Stock

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1,409

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,214 parts In-Stock

1+ parts

$13.070

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1,214

$13.070

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SupplyDigital Components

Austria . 4,277 parts In-Stock

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4,277

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TANS Electronics

Latvia . 2,068 parts In-Stock

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Microchip USA

USA . 1,716 parts In-Stock

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1,716

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Corphita

USA . 1,664 parts In-Stock

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1,664

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Problanco Electronics

Mexico . 1,095 parts In-Stock

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1,095

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Kulean Microsystems

USA . 806 parts In-Stock

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806

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UHIMA Technologies

Türkiye . 582 parts In-Stock

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582

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Corohmni

South Africa . 360 parts In-Stock

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Overview

Discover the reliable and high-quality NCV8163ASN500T1G by Onsemi, a leading manufacturer in the industry. This Fixed Regulator - Positive Single Output LDO is perfect for a variety of applications, offering customers exceptional value and benefits. With its compact design, top-notch performance, and AEC-Q100 screening level, this product guarantees stability and efficiency. Trust Onsemi to deliver cutting-edge technology that meets your needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Operating Temperature (TJ-Max): 125 °C

Can operate in high-temperature environments without compromising performance, making it suitable for various applications.

No. of Terminals: 5

Provides flexibility and connectivity options for easy integration into different circuit configurations.

Nominal Output Voltage-1: 5 V

Stable and consistent output voltage for powering various electronic components with precision.

Adjustability: FIXED

Fixed output voltage eliminates the need for adjustment, simplifying design and reducing complexity.

Maximum Output Current-1: 0.25 A

Capable of delivering sufficient current to power small to medium-sized loads efficiently.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV8163ASN500T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

1 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G5

Length:

3 mm

Maximum Load Regulation:

.18675 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.25 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

2 %

Width:

1.5 mm

Trade Compliance

NCV8163ASN500T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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