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NCV7240DPR2G

Onsemi

NCV7240DPR2G by Onsemi

NCV7240DPR2G by Onsemi is a small outline interface IC with 24 terminals and a max supply voltage of 5.5V. It features a peak output current of 0.6A, suitable for various applications in automotive electronics requiring bipolar technology and AEC-Q100 screening compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Rotakorn

Sweden . 40,000 parts In-Stock

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40,000

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ComSIT Distribution GmbH

Germany . 25,500 parts In-Stock

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25,500

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Chip Stock

USA . 23,569 parts In-Stock

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23,569

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Vyrian

USA . 5,696 parts In-Stock

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5,696

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NexGen Digital

USA . 2,440 parts In-Stock

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2,440

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Digiode

USA . 1,856 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Vigor

Singapore . 770 parts In-Stock

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$1.120

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770

$1.120

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Aztec Data Supply Inc.

USA . 3,813 parts In-Stock

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$4.080

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$4.080

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AZTECH Wire

Italy . 476 parts In-Stock

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$11.875

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476

$11.875

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Ampacity Inc.

Singapore . 583 parts In-Stock

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$31.500

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583

$31.500

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Semicontronic

India . 1,022 parts In-Stock

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$42.500

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$41.438

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$41.225

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$42.500

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$41.225

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RC Electronics

USA . 49,652 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 7,454 parts In-Stock

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Problanco Electronics

Mexico . 5,903 parts In-Stock

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Kepictronics

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Infinite Electronics LLP (Excess)

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,923 parts In-Stock

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SupplyDigital Components

Austria . 1,641 parts In-Stock

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UHIMA Technologies

Türkiye . 823 parts In-Stock

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823

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Corphita

USA . 735 parts In-Stock

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Corohmni

South Africa . 485 parts In-Stock

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TANS Electronics

Latvia . 420 parts In-Stock

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Continental Prestige Electronics

USA . 177 parts In-Stock

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Bastille Electronics

Australia . 67 parts In-Stock

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Overview

Enhance your electronic designs with the NCV7240DPR2G by Onsemi. This Interface IC offers unparalleled quality and reliability, backed by Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this product provides seamless integration and superior performance. Elevate your projects with the value and benefits that only Onsemi can deliver. Discover the advantages of the NCV7240DPR2G and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection for the internal components, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs, making it versatile for different applications.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring robust performance in harsh conditions.

Power Supplies (V): 3.3/5

Supports multiple power supply options, giving flexibility in designing circuits.

No. of Terminals: 24

Provides ample connection points for interfacing with other components, enhancing functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures reliable electrical contacts and corrosion resistance for long-term usage.

Maximum Seated Height: 1.75 mm

Has a low profile design, suitable for compact electronic devices.

Maximum Output Current: 0.6 A

Capable of delivering high current output, suitable for driving various loads.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing between different parts of a system, facilitating smooth communication.

Technical Specifications

Other Function Interface ICs NCV7240DPR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 5V

Driver No. of Bits:

8

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Output Current:

.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NCV7240DPR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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