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NCV57302DSADJR4G

Onsemi

NCV57302DSADJR4G by Onsemi

NCV57302DSADJR4G by Onsemi is an adjustable positive single output LDO regulator with a max output current of 3A and a max dropout voltage of 0.52V. It is designed for applications requiring precise voltage regulation in automotive environments, featuring AEC-Q100 screening level and operating temperature range from -40°C to 125°C.

Median Price

$2.137

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,293 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.830

10k+ parts

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4,293

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$1.830

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Flip Electronics (Authorized)

USA . 4,293 parts In-Stock

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4,293

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Verical

USA . 800 parts In-Stock

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$2.444

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800

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$2.444

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.548

100+ parts

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300

$2.548

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Digiode

USA . 500 parts In-Stock

1+ parts

$4.351

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500

$4.351

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Chip Stock

USA . 71,000 parts In-Stock

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71,000

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Flip Electronics

USA . 4,293 parts In-Stock

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4,293

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Vyrian

USA . 1,405 parts In-Stock

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1,405

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Distributors (Availability)

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Semicontronic

India . 1,139 parts In-Stock

1+ parts

$2.080

100+ parts

$2.028

1k+ parts

$2.018

10k+ parts

-

1,139

$2.080

$2.028

$2.018

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Corohmni

South Africa . 498 parts In-Stock

1+ parts

$2.447

100+ parts

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498

$2.447

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Continental Prestige Electronics

USA . 3,266 parts In-Stock

1+ parts

$2.548

100+ parts

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$2.497

3,266

$2.548

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-

$2.497

Argo Parts USA

USA . 3,087 parts In-Stock

1+ parts

$2.548

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3,087

$2.548

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Vigor

Singapore . 674 parts In-Stock

1+ parts

$3.090

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674

$3.090

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Ampacity Inc.

Singapore . 1,793 parts In-Stock

1+ parts

$3.970

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1,793

$3.970

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Corphita

USA . 2,478 parts In-Stock

1+ parts

$4.122

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$4.122

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Aztec Data Supply Inc.

USA . 84 parts In-Stock

1+ parts

$7.020

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84

$7.020

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TANS Electronics

Latvia . 5,923 parts In-Stock

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5,923

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Kulean Microsystems

USA . 5,595 parts In-Stock

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SupplyDigital Components

Austria . 5,423 parts In-Stock

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Problanco Electronics

Mexico . 5,129 parts In-Stock

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Perfect Parts

USA . 4,184 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 745 parts In-Stock

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745

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$2.497

1k+ parts

$2.421

10k+ parts

$2.370

100

-

$2.497

$2.421

$2.370

Overview

Experience unrivaled quality and reliability with the NCV57302DSADJR4G by Onsemi, a leading manufacturer in the industry. This adjustable regulator offers exceptional performance in a variety of applications, ensuring stable power supply with minimal dropout voltage. With advanced CMOS technology and AEC-Q100 screening level, this LDO regulator provides precise regulation and efficiency. Say goodbye to voltage fluctuations and hello to seamless operations with Onsemi's NCV57302DSADJR4G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Maximum Dropout Voltage: 1.52 V

Low dropout voltage ensures efficient power conversion, minimizing power loss and maximizing energy efficiency.

Surface Mount: YES

Surface mount capability allows for easy and space-efficient PCB assembly, suitable for compact electronic devices.

Operating Temperature (TJ-Max): 125 °C

High operating temperature range ensures reliable performance in various environmental conditions.

Screening Level: AEC-Q100

AEC-Q100 screening level guarantees automotive-grade quality and reliability, suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making the regulator energy-efficient and suitable for battery-powered devices.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and provides space-saving benefits.

Terminal Form: GULL WING

Gull wing terminal form facilitates reliable soldering connections and enhances overall product durability.

Operating Temperature (TJ-Min): -40 °C

Wide operating temperature range allows for operation in extreme cold environments.

Packing Method: TR

TR (Tape and Reel) packing method ensures easy handling and automatic pick-and-place assembly during mass production.

Maximum Load Regulation (%): 1 %

Low maximum load regulation ensures stable output voltage under varying load conditions, maintaining system reliability.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCV57302DSADJR4G attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.52 V

Nominal Dropout Voltage-1:

.315 V

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e3

Length:

10.02 mm

Maximum Line Regulation (%/V):

.043

Maximum Load Regulation (%):

1 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

13 V

Minimum Output Voltage-1:

1.24 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.54,67TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

4.826 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.702 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9.1945 mm

Trade Compliance

NCV57302DSADJR4G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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