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NCV4305QDR2G

Onsemi

NCV4305QDR2G by Onsemi

NCV4305QDR2G by Onsemi is an AEC-Q100 compliant switching controller with a 12V nominal voltage and 500 kHz max switching frequency. This small outline IC, suitable for automotive applications, features a dual terminal position and operates b/w -40 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,494 parts In-Stock

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Digiode

USA . 1,102 parts In-Stock

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Kulean Microsystems

USA . 3,706 parts In-Stock

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SupplyDigital Components

Austria . 3,303 parts In-Stock

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Problanco Electronics

Mexico . 2,513 parts In-Stock

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Corphita

USA . 1,633 parts In-Stock

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TANS Electronics

Latvia . 962 parts In-Stock

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UHIMA Technologies

Türkiye . 615 parts In-Stock

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Corohmni

South Africa . 53 parts In-Stock

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Overview

Enhance the performance of your automotive electronics with the NCV4305QDR2G by Onsemi. This high-quality switching regulator offers reliable power control and efficiency, ensuring optimal functionality in various applications. With Onsemi's reputation for superior manufacturing standards, you can trust in the durability and longevity of this product. Experience seamless integration and improved performance with the NCV4305QDR2G, providing value and benefits that exceed expectations. Upgrade your automotive systems today with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and insulation properties, making the product durable and reliable.

Surface Mount: YES

Being surface mountable makes the product easier to assemble and saves PCB space.

Screening Level: AEC-Q100

Having AEC-Q100 screening level ensures high reliability and quality, making it suitable for automotive applications.

Nominal Supply Voltage (Vsup): 12 V

With a nominal supply voltage of 12V, this regulator/controller is ideal for applications requiring this specific voltage level.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions without any performance degradation.

Maximum Switching Frequency: 500 kHz

The high switching frequency enables efficient power conversion, making the product suitable for high-performance applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures secure electrical connections.

Technical Specifications

Switching Regulators & Controllers NCV4305QDR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

60 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Maximum Switching Frequency:

500 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

NCV4305QDR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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