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NCV4305DDR2G

Onsemi

NCV4305DDR2G by Onsemi

NCV4305DDR2G by Onsemi is a switching controller with 8 terminals, operating at -40 to 125 °C. It has a max supply current of 60mA and can switch up to 500kHz. Ideal for automotive applications due to AEC-Q100 screening level and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,625 parts In-Stock

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1,625

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Digiode

USA . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,720 parts In-Stock

1+ parts

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6,720

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TANS Electronics

Latvia . 4,297 parts In-Stock

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4,297

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Kulean Microsystems

USA . 1,850 parts In-Stock

1+ parts

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1,850

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Problanco Electronics

Mexico . 1,119 parts In-Stock

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1,119

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Corphita

USA . 875 parts In-Stock

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875

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Corohmni

South Africa . 434 parts In-Stock

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434

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UHIMA Technologies

Türkiye . 9 parts In-Stock

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9

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Overview

Elevate your electronic designs with the NCV4305DDR2G by Onsemi, a top-tier manufacturer known for delivering high-quality switching regulators and controllers. Ideal for automotive applications, this compact yet powerful product offers customers unmatched value and benefits. With a wide supply voltage range, small outline package style, and AEC-Q100 screening level, this versatile component provides reliability and efficiency at both high and low temperatures. Experience the advantage of seamless integration and enhanced performance with the NCV4305DDR2G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for a wide range of operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing manual labor during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability, making the product suitable for automotive applications with stringent performance requirements.

Nominal Supply Voltage (Vsup): 12 V

12V supply voltage makes this product compatible with a wide range of applications and power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in harsh environments and during extended operation.

Maximum Switching Frequency: 500 kHz

High switching frequency enables efficient power conversion, reducing energy loss and improving overall system efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides robust solder joints, ensuring secure connections and reliable operation in demanding conditions.

Technical Specifications

Switching Regulators & Controllers NCV4305DDR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

60 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Maximum Switching Frequency:

500 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

NCV4305DDR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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