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NCV4279CD250R2G

Onsemi

NCV4279CD250R2G by Onsemi

NCV4279CD250R2G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max dropout voltage of 0.5V. It is designed for applications requiring a compact solution with low power consumption, such as automotive electronics and industrial control systems. Operating temperature ranges from -40 °C to 150°C, making it suitable for harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,313 parts In-Stock

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Digiode

USA . 460 parts In-Stock

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460

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Vigor

Singapore . 541 parts In-Stock

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$0.830

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541

$0.830

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AZTECH Wire

Italy . 55 parts In-Stock

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$17.630

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55

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QUARKTWIN TECHNOLOGY LTD

USA . 28,673 parts In-Stock

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SupplyDigital Components

Austria . 4,114 parts In-Stock

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TANS Electronics

Latvia . 3,460 parts In-Stock

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Kulean Microsystems

USA . 3,364 parts In-Stock

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Corphita

USA . 1,797 parts In-Stock

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Problanco Electronics

Mexico . 1,449 parts In-Stock

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UHIMA Technologies

Türkiye . 345 parts In-Stock

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345

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Microchip USA

USA . 256 parts In-Stock

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Corohmni

South Africa . 133 parts In-Stock

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Overview

Unleash the power of reliable voltage regulation with the NCV4279CD250R2G by Onsemi. Crafted with precision and quality, this fixed regulator offers a seamless solution for your electronic needs. From automotive to industrial applications, this LDO ensures stable output voltage with minimal dropout. Trust in the expertise of Onsemi to deliver cutting-edge technology that maximizes performance and efficiency. Elevate your projects with the NCV4279CD250R2G and experience unmatched reliability and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a reliable and long-lasting product.

Maximum Dropout Voltage-1: 1.5 V

Allows for stable output voltage even when the input voltage fluctuates, providing consistent performance.

Surface Mount: YES

Enables easy and secure installation on PCBs, saving time during assembly.

Operating Temperature (TJ-Max): 150 °C

Suitable for a wide range of environmental conditions, making it versatile for various applications.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring reliability and performance in automotive applications.

Nominal Output Voltage-1: 5 V

Delivers a stable and consistent output voltage, meeting the requirements of many electronic devices.

Maximum Output Current-1: 1.5 A

Capable of providing sufficient current to power high-demand applications, making it versatile for a variety of devices.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV4279CD250R2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.5 V

Maximum Input Voltage:

26 V

Minimum Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

3.9 mm

Trade Compliance

NCV4279CD250R2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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