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NCV2890DMR2G

Onsemi

NCV2890DMR2G by Onsemi

NCV2890DMR2G by Onsemi is an audio amplifier IC with 8 terminals, operating voltage of 2.2-5.5V, and output power of 1.08W. It is designed for industrial applications, featuring a small outline package with thin profile suitable for surface mount assembly in audio and video amplifiers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,143 parts In-Stock

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Digiode

USA . 1,744 parts In-Stock

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AZTECH Wire

Italy . 128 parts In-Stock

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$21.280

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128

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Kepictronics

USA . 24,000 parts In-Stock

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TANS Electronics

Latvia . 8,338 parts In-Stock

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Kulean Microsystems

USA . 3,361 parts In-Stock

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Corphita

USA . 2,215 parts In-Stock

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UHIMA Technologies

Türkiye . 552 parts In-Stock

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552

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Problanco Electronics

Mexico . 436 parts In-Stock

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436

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Microchip USA

USA . 394 parts In-Stock

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394

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Corohmni

South Africa . 165 parts In-Stock

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SupplyDigital Components

Austria . 21 parts In-Stock

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Overview

Elevate your audio experience with the NCV2890DMR2G by Onsemi. Crafted with precision and expertise, this audio amplifier offers unparalleled quality and reliability in a compact package. Perfect for a wide range of applications in the audio and video industry, this product delivers exceptional performance and efficiency. With a wide operating temperature range and low power consumption, the NCV2890DMR2G provides value and benefits that exceed customer expectations. Upgrade your sound system today and immerse yourself in crystal-clear audio like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the amplifier lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy installation on printed circuit boards, saving space and facilitating automated assembly processes.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality, making this amplifier suitable for automotive applications where reliability is crucial.

Power Supplies (V): 2.5/5

Having flexible power supply options of 2.5V or 5V allows for compatibility with a wide range of systems and power sources.

Nominal Output Power: 1.08 W

The substantial output power of 1.08W ensures adequate amplification for audio signals, making it suitable for various audio applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 °C ensures reliable performance even in extreme cold conditions, making it suitable for diverse environments.

Technical Specifications

Audio & Video Amplifiers NCV2890DMR2G attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.08 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

NCV2890DMR2G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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