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NCV1009Z

Onsemi

NCV1009Z by Onsemi

NCV1009Z by Onsemi is a voltage reference IC with an output voltage range of 2.492V to 2.508V and a max voltage tolerance of 0.8%. It operates in temperatures from -40 °C to 125°C, making it suitable for automotive applications requiring precise voltage regulation in a compact cylindrical package.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,373 parts In-Stock

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Digiode

USA . 1,575 parts In-Stock

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Vigor

Singapore . 858 parts In-Stock

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$0.370

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AZTECH Wire

Italy . 435 parts In-Stock

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$11.260

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Component Stockers USA

USA . 510 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,678 parts In-Stock

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TANS Electronics

Latvia . 8,311 parts In-Stock

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Kulean Microsystems

USA . 8,252 parts In-Stock

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Microchip USA

USA . 4,927 parts In-Stock

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SupplyDigital Components

Austria . 1,636 parts In-Stock

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Problanco Electronics

Mexico . 1,555 parts In-Stock

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UHIMA Technologies

Türkiye . 858 parts In-Stock

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Corphita

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Corohmni

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Overview

Experience precision and reliability with the NCV1009Z by Onsemi, a top-tier manufacturer known for quality products. This voltage reference is a game-changer in the automotive industry, offering unmatched value and performance. With a trimmable output and a wide temperature range, this product ensures accurate voltage regulation in any application. Trust Onsemi to deliver cutting-edge technology and superior products that exceed your expectations. Elevate your projects with the NCV1009Z today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the voltage reference, ensuring a longer lifespan.

Trim or Adjustable Output (V): YES

The ability to trim or adjust the output voltage allows for fine-tuning and customization to meet specific application requirements.

Package Shape: ROUND

The round shape makes this voltage reference easy to install and integrate into various electronic systems.

No. of Terminals: 3

Having 3 terminals provides additional flexibility and options for connecting the voltage reference.

Package Style (Meter): CYLINDRICAL

The cylindrical package style enhances the convenience of mounting and handling this voltage reference.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this voltage reference can perform reliably in a wide range of environmental conditions.

Minimum Output Voltage: 2.492 V

This minimum output voltage ensures stable and accurate reference voltage for precision electronic applications.

Technology: BIPOLAR

The bipolar technology used in this voltage reference offers excellent accuracy and stability for voltage references.

Nominal Output Voltage: 2.5 V

The nominal output voltage of 2.5 V provides a standard reference value that is commonly used in various electronic circuits.

Technical Specifications

Voltage References NCV1009Z attributes and parameters. Explore more Voltage References devices from Onsemi

Specs

JESD-30 Code:

O-PBCY-W3

JESD-609 Code:

e0

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

2.508 V

Minimum Output Voltage:

2.492 V

Nominal Output Voltage:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Sub-Category:

Voltage References

Surface Mount:

NO

Technology:

BIPOLAR

Max Voltage Temp Coef:

15 ppm/Cel

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

WIRE

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Trim or Adjustable Output (V):

YES

Maximum Voltage Tolerance:

.8 %

Trade Compliance

NCV1009Z Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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