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NCV1009D

Onsemi

NCV1009D by Onsemi

NCV1009D by Onsemi is a voltage reference IC with trimmable output (2.492-2.508V) in a small outline package for automotive applications. Operating from -40 to 125 °C, it offers a max voltage tolerance of 0.8% and temp coefficient of 15 ppm/°C, making it ideal for precision voltage regulation in automotive electronics.

Median Price

$0.475

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 132 parts In-Stock

1+ parts

-

100+ parts

$0.475

1k+ parts

$0.395

10k+ parts

$0.352

132

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$0.475

$0.395

$0.352

Distributors (In-Stock)

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Digiode

USA . 560 parts In-Stock

1+ parts

$0.370

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560

$0.370

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Vyrian

USA . 8,240 parts In-Stock

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Electronics Depot

USA . 11 parts In-Stock

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11

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Distributors (Availability)

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Corphita

USA . 1,333 parts In-Stock

1+ parts

$0.351

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1,333

$0.351

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Vigor

Singapore . 536 parts In-Stock

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$0.370

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536

$0.370

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Corohmni

South Africa . 123 parts In-Stock

1+ parts

$0.390

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123

$0.390

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AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$11.450

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845

$11.450

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TANS Electronics

Latvia . 7,706 parts In-Stock

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7,706

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Problanco Electronics

Mexico . 7,300 parts In-Stock

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7,300

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Kulean Microsystems

USA . 1,571 parts In-Stock

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1,571

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SupplyDigital Components

Austria . 1,556 parts In-Stock

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UHIMA Technologies

Türkiye . 825 parts In-Stock

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825

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Microchip USA

USA . 349 parts In-Stock

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349

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Overview

Discover the NCV1009D by Onsemi, a high-quality voltage reference that offers exceptional value and benefits to customers. With its reliable manufacturer and versatile applications in various industries, this product provides stable output voltage with minimal temperature coefficient, making it ideal for automotive and industrial applications. Trust Onsemi for superior performance and precision in your voltage reference needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection for the internal components of the voltage reference, making it a reliable choice for various applications.

Surface Mount: YES

The ability to be surface mounted allows for easy and convenient integration of the voltage reference onto circuit boards, saving time and effort during assembly.

Trim or Adjustable Output (V): YES

Having trim or adjustable output voltage capability provides flexibility in calibrating and fine-tuning the output to meet specific requirements, making it suitable for precision applications.

No. of Terminals: 8

With 8 terminals, this voltage reference allows for more connections and options in circuit design, enabling versatile usage in different electronic systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance and stability even under harsh thermal conditions, making it suitable for industrial and automotive applications.

Minimum Output Voltage: 2.492 V

The minimum output voltage of 2.492 V guarantees a consistent and accurate reference voltage output, crucial for maintaining the integrity of other components in the system.

Maximum Output Voltage: 2.508 V

The maximum output voltage of 2.508 V ensures that the voltage reference can provide a stable reference voltage within a tight range, essential for precision applications.

Temperature Grade: AUTOMOTIVE

Being automotive-grade indicates that this voltage reference meets strict quality and reliability standards required for automotive applications, ensuring safe and efficient operation in vehicles.

Technical Specifications

Voltage References NCV1009D attributes and parameters. Explore more Voltage References devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

2.508 V

Minimum Output Voltage:

2.492 V

Nominal Output Voltage:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Voltage References

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

15 ppm/Cel

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

YES

Maximum Voltage Tolerance:

.8 %

Width (mm):

3.9 mm

Trade Compliance

NCV1009D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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