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NCS2200SQ2T2

Onsemi

NCS2200SQ2T2 by Onsemi

NCS2200SQ2T2 by Onsemi is a CMOS comparator with 8000uV max input offset voltage, 0.01uA max average bias current, and 1100ns nominal response time. Ideal for industrial applications requiring push-pull output type in a small outline package with dual terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Sensible Micro Corp

USA . 2,499 parts In-Stock

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Vyrian

USA . 2,303 parts In-Stock

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Digiode

USA . 1,097 parts In-Stock

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Ampacity Inc.

Singapore . 304 parts In-Stock

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$3.410

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304

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AZTECH Wire

Italy . 938 parts In-Stock

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$10.490

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SupplyDigital Components

Austria . 4,385 parts In-Stock

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Kulean Microsystems

USA . 4,047 parts In-Stock

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Problanco Electronics

Mexico . 3,308 parts In-Stock

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TANS Electronics

Latvia . 2,407 parts In-Stock

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Corphita

USA . 1,266 parts In-Stock

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Vigor

Singapore . 852 parts In-Stock

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UHIMA Technologies

Türkiye . 474 parts In-Stock

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Microchip USA

USA . 371 parts In-Stock

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Corohmni

South Africa . 201 parts In-Stock

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Overview

Unlock precision and reliability with the NCS2200SQ2T2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality comparators like this one, perfect for a wide range of applications. This small-outline, thin-profile package offers high performance with minimal power consumption, making it ideal for industrial use. Experience fast response times and accurate results with the NCS2200SQ2T2, providing unmatched value and efficiency for your projects. Elevate your designs with the best in comparator technology from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in providing durability and resistance to environmental factors, ensuring a longer lifespan for the product.

Maximum Input Offset Voltage: 8000 uV

Low input offset voltage ensures accurate and precise measurements, making this product suitable for applications requiring high precision.

Maximum Average Bias Current (IIB): 0.01 uA

Low bias current minimizes power consumption and ensures stable performance over a long period of time, making it ideal for low-power applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3

Suitable nominal supply voltage ensures compatibility with a wide range of electronic systems, making it versatile for various applications.

Power Supplies (V): 1/5

Support for multiple power supplies allows for flexibility in connecting to different power sources, making it adaptable to various operating environments.

No. of Terminals: 5

Having a limited number of terminals simplifies the installation process and reduces the chances of wiring errors, ensuring ease of use.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design with a small outline and thin profile saves space on the PCB and allows for dense board layouts, making it suitable for applications with limited space.

Maximum Supply Voltage Limit: 6 V

High supply voltage limit provides protection against overvoltages, enhancing the reliability and robustness of the product in different operating conditions.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures reliable performance in harsh environments, making it suitable for industrial applications where temperature fluctuations are common.

Output Type: PUSH-PULL

Push-pull output type provides both sourcing and sinking capabilities, making it versatile for driving different loads and achieving bidirectional control.

Nominal Response Time: 1100 ns

Fast response time enables quick signal processing, making it suitable for applications requiring rapid decision-making and high-speed operation.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the product to operate efficiently in extreme cold conditions, making it suitable for applications in harsh climates.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring reliable connections and facilitating the assembly process.

Terminal Position: DUAL

Dual terminal position allows for easy connection and compatibility with different PCB layouts, enhancing the versatility and ease of integration.

Maximum Seated Height: 1.1 mm

Low seated height minimizes the profile of the component on the PCB, enabling compact designs and reducing overall system size.

Width: 1.25 mm

Narrow width saves space on the PCB and allows for dense board layouts, enabling efficient use of available board real estate.

Peak Reflow Temperature °C: 235

High peak reflow temperature tolerance ensures reliable soldering during assembly processes, making it suitable for automated manufacturing.

Length: 2 mm

Compact length allows for space-efficient placement on the PCB, contributing to overall system miniaturization and reducing overall product footprint.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in rugged environments with temperature variations, making it suitable for industrial automation and control applications.

Maximum Negative Supply Voltage Limit: 0 V

Support for negative supply voltage limit provides flexibility in power supply configurations, enabling compatibility with a wide range of system designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mounting on PCBs, ensuring secure connections and reliable performance in various applications.

Amplifier Type: COMPARATOR

Comparator amplifier type enables precise voltage comparisons, making it ideal for applications such as voltage level detection and signal conditioning.

Maximum Supply Current: 0.017 mA

Low supply current consumption minimizes power dissipation and extends battery life, making the product suitable for portable and battery-powered devices.

Nominal Negative Supply Voltage (Vsup): 0 V

Zero nominal negative supply voltage simplifies power supply requirements and reduces design complexity, making it easy to integrate into existing systems.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting on the PCB, enabling compact and space-efficient circuit designs.

Technical Specifications

Comparators NCS2200SQ2T2 attributes and parameters. Explore more Comparators devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

1/5 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

8 mV

Peak Bias Current:

10 nA

Operational Characteristics

Maximum Supply Current:

17 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

235 °C (455 °F)

Nominal Response Time:

1.1 µs

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

5

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP5/6,.08

Trade Compliance

NCS2200SQ2T2 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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