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NCS12802MNTXG

Onsemi

NCS12802MNTXG by Onsemi

NCS12802MNTXG by Onsemi is a 24-terminal chip carrier with power supplies of 3.3V and 15V, suitable for industrial applications. It operates b/w -40 °C to 95°C, has a peak reflow temperature of 260°C, and features a no-lead terminal form. Ideal for analog circuit designs requiring surface mount square packages in plastic/epoxy material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,884 parts In-Stock

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Digiode

USA . 1,482 parts In-Stock

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AZTECH Wire

Italy . 1,216 parts In-Stock

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$15.850

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TANS Electronics

Latvia . 7,166 parts In-Stock

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Kulean Microsystems

USA . 4,461 parts In-Stock

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SupplyDigital Components

Austria . 3,124 parts In-Stock

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Problanco Electronics

Mexico . 3,022 parts In-Stock

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Corphita

USA . 937 parts In-Stock

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UHIMA Technologies

Türkiye . 571 parts In-Stock

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Microchip USA

USA . 467 parts In-Stock

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Corohmni

South Africa . 353 parts In-Stock

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Overview

Unleash the power of innovation with the NCS12802MNTXG by Onsemi, a cutting-edge solution in the category of Other Function Semiconductors. Designed with precision and quality in mind, this product offers unparalleled performance and reliability for your electronic applications. With a package style of CHIP CARRIER and a temperature grade of INDUSTRIAL, this semiconductor is built to withstand the toughest conditions. Whether you are looking to enhance your power supplies or optimize your analog circuits, the NCS12802MNTXG delivers exceptional value and benefits that will take your projects to the next level. Experience the difference with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and protection for the semiconductor components inside.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more efficient, saving time and effort.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy alignment during PCB layout.

Power Supplies (V): 3.3,15

The availability of both 3.3V and 15V power supplies allows for flexibility in different circuit designs and applications.

No. of Terminals: 24

Having 24 terminals provides ample connection options for various inputs and outputs, making the product versatile.

Package Style (Meter): CHIP CARRIER

The chip carrier style package offers good thermal conductivity and protection for the semiconductor chip inside.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95 °C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C indicates the product's capability to withstand extreme cold temperatures.

Terminal Finish: TIN

The use of tin as the terminal finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connection with other components on the circuit board.

Other IC type: ANALOG CIRCUIT

Being an analog circuit type, this product is suitable for applications requiring accurate and continuous signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds prevents overheating and damage to the semiconductor components during soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures a strong and reliable solder joint during assembly.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the product is suitable for use in harsh industrial environments with wide temperature ranges.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and complies with regulations on hazardous substances in electronics.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5mm allows for compact and efficient placement of terminals on the package body.

Technical Specifications

Other Function Semiconductors NCS12802MNTXG attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,15

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCS12802MNTXG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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