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NCP58302DSADJR4G

Onsemi

NCP58302DSADJR4G by Onsemi

NCP58302DSADJR4G by Onsemi is an adjustable positive single output LDO regulator with a max output current of 3A and a max dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring precise voltage regulation in compact electronic devices.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 5,458 parts In-Stock

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Flip Electronics

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Digiode

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Vigor

Singapore . 575 parts In-Stock

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$2.810

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AZTECH Wire

Italy . 1,174 parts In-Stock

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Component Stockers USA

USA . 582 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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SupplyDigital Components

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Kulean Microsystems

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Perfect Parts

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TANS Electronics

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Corohmni

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Overview

Unleash the power of precision with the NCP58302DSADJR4G by Onsemi. This adjustable positive single output LDO regulator is a game-changer in the world of technology, offering unmatched quality and reliability. From its compact design to its impressive performance, this regulator is perfect for a wide range of applications. Whether you're looking to optimize power management in your IoT devices or enhance the efficiency of your industrial control systems, this product delivers exceptional value. Take your projects to the next level with the NCP58302DSADJR4G and experience the difference that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and light weight, making the product suitable for a wide range of applications.

Maximum Dropout Voltage: 1.6V

Low dropout voltage ensures efficient power management and performance even with small voltage differentials.

Surface Mount: YES

Allows for easy installation and integration into modern electronic designs.

Operating Temperature (TJ-Max): 125 °C

Operates efficiently in high temperature environments, suitable for various industrial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient regulation of output voltage.

Package Shape: RECTANGULAR

Space-efficient design for compact electronic devices and circuit layouts.

Terminal Form: GULL WING

Ideal for surface mount applications and provides secure solder connections.

Operating Temperature (TJ-Min): -40 °C

Capable of functioning in extreme cold conditions without affecting performance.

Minimum Output Voltage: 1.24V

Provides a stable minimum output voltage for a wide range of electrical devices and components.

No. of Terminals: 5

Sufficient number of terminals for easy connectivity and integration within circuits.

Maximum Line Regulation (%/V): 0.044

Offers precise regulation of output voltage in response to changes in input voltage, ensuring consistent performance.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Efficient heat dissipation and compact design for optimal performance in limited space.

Adjustability: ADJUSTABLE

Allows for fine-tuning of output voltage according to specific requirements of the application.

Maximum Load Regulation (%): 1%

Maintains a stable output voltage under varying load conditions, ensuring reliable operation.

Terminal Pitch: 1.702mm

Provides precise spacing for easy soldering and secure terminal connections.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

Specifically designed for precise voltage regulation with low dropout, ideal for sensitive electronic components.

Terminal Finish: MATTE TIN

Durable terminal finish for long-lasting performance and secure solder connections.

Terminal Position: SINGLE

Simplified terminal layout for easy installation and integration within circuits.

Maximum Output Voltage: 12.9V

Provides a high output voltage range suitable for a variety of electronic devices and components.

Maximum Seated Height: 4.826mm

Low profile design for compact and space-efficient electronic applications.

Width: 9.1945mm

Compact width for easy integration into various electronic designs and projects.

Maximum Output Current: 3A

High output current capability for powering a range of electronic devices and components.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow processes for secure and reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for efficient soldering in manufacturing processes.

Nominal Dropout Voltage: 0.37V

Low dropout voltage for efficient power conversion and regulation, enhancing overall performance.

Length: 10.02mm

Compact length for space-efficient installation and integration within electronic systems.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCP58302DSADJR4G attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.37 V

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e3

Length:

10.02 mm

Maximum Line Regulation (%/V):

.044

Maximum Load Regulation (%):

1 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

12.9 V

Minimum Output Voltage-1:

1.24 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.54,67TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

4.826 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.702 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9.1945 mm

Trade Compliance

NCP58302DSADJR4G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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