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NCP4894DMR2

Onsemi

NCP4894DMR2 by Onsemi

NCP4894DMR2 by Onsemi is an audio amplifier IC with 10 terminals, operating temperature range of -40 to 85°C. It offers a nominal output power of 1.08W and operates at supply voltages from 2.2V to 5.5V. This small outline package is ideal for industrial applications requiring compact audio amplification solutions.

Median Price

$0.942

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$0.925

1k+ parts

$0.767

10k+ parts

$0.684

4,000

-

$0.925

$0.767

$0.684

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.959

10k+ parts

$0.855

4,000

-

-

$0.959

$0.855

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 619 parts In-Stock

1+ parts

$0.720

100+ parts

-

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-

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619

$0.720

-

-

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Vyrian

USA . 2,205 parts In-Stock

1+ parts

-

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2,205

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 25 parts In-Stock

1+ parts

$0.182

100+ parts

$0.166

1k+ parts

$0.149

10k+ parts

-

25

$0.182

$0.166

$0.149

-

Corphita

USA . 2,209 parts In-Stock

1+ parts

$0.682

100+ parts

-

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-

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2,209

$0.682

-

-

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Vigor

Singapore . 991 parts In-Stock

1+ parts

$0.730

100+ parts

-

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-

10k+ parts

-

991

$0.730

-

-

-

Corohmni

South Africa . 297 parts In-Stock

1+ parts

$0.758

100+ parts

-

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297

$0.758

-

-

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AZTECH Wire

Italy . 1,214 parts In-Stock

1+ parts

$12.230

100+ parts

-

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-

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1,214

$12.230

-

-

-

Problanco Electronics

Mexico . 7,808 parts In-Stock

1+ parts

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7,808

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Microchip USA

USA . 4,851 parts In-Stock

1+ parts

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4,851

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.687

10k+ parts

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4,000

-

-

$0.687

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SupplyDigital Components

Austria . 2,529 parts In-Stock

1+ parts

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100+ parts

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2,529

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Kulean Microsystems

USA . 1,166 parts In-Stock

1+ parts

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1,166

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UHIMA Technologies

Türkiye . 501 parts In-Stock

1+ parts

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501

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TANS Electronics

Latvia . 247 parts In-Stock

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247

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Overview

Enhance your audio and video experience with the NCP4894DMR2 by Onsemi. Crafted with precision and expertise, this audio amplifier offers unparalleled quality and performance in a compact package. Whether you're looking to upgrade your home entertainment system or enhance your sound system, this product provides crystal-clear audio output with minimal distortion. With a wide operating temperature range and easy surface mount installation, the NCP4894DMR2 is the perfect choice for any audio application. Trust Onsemi for superior products that deliver value and reliability every time. Elevate your audio experience today with the NCP4894DMR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the amplifier easy to handle and resistant to wear and tear.

Surface Mount: YES

Surface mount technology allows for easier installation and saves space on the circuit board.

Package Shape: SQUARE

The square shape provides a compact form factor, making it suitable for various applications where space is limited.

Nominal Output Power: 1.08 W

With a decent output power, this amplifier can drive speakers or headphones effectively for good audio performance.

Minimum Supply Voltage (Vsup): 2.2 V

The low minimum supply voltage requirement enables this amplifier to operate efficiently even with limited power sources.

Maximum Operating Temperature: 85 °C

This amplifier can withstand high operating temperatures, ensuring reliable performance even in demanding environments.

Technical Specifications

Audio & Video Amplifiers NCP4894DMR2 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.08 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

NCP4894DMR2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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