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NCP337FCT2G

Onsemi

NCP337FCT2G by Onsemi

SPST; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 1; Terminal Finish: TIN SILVER COPPER;

Median Price

$0.439

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,170 parts In-Stock

1+ parts

$3.090

100+ parts

$1.020

1k+ parts

$0.678

10k+ parts

-

1,170

$3.090

$1.020

$0.678

-

Avnet

USA . 6,000 parts In-Stock

1+ parts

-

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6,000

-

-

-

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Verical

USA . 2,338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.439

10k+ parts

$0.392

2,338

-

-

$0.439

$0.392

Rochester

USA . 1,338 parts In-Stock

1+ parts

-

100+ parts

$0.423

1k+ parts

$0.351

10k+ parts

$0.313

1,338

-

$0.423

$0.351

$0.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,423 parts In-Stock

1+ parts

$0.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,423

$0.330

-

-

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$0.366

100+ parts

-

1k+ parts

-

10k+ parts

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870

$0.366

-

-

-

Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

$1.313

100+ parts

$0.486

1k+ parts

$0.341

10k+ parts

-

3,000

$1.313

$0.486

$0.341

-

Chip Stock

USA . 48,000 parts In-Stock

1+ parts

-

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48,000

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Vyrian

USA . 4,348 parts In-Stock

1+ parts

-

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4,348

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

1+ parts

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3,000

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Dan-Mar Components

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,052 parts In-Stock

1+ parts

$0.295

100+ parts

-

1k+ parts

-

10k+ parts

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4,052

$0.295

-

-

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Corphita

USA . 2,042 parts In-Stock

1+ parts

$0.312

100+ parts

-

1k+ parts

-

10k+ parts

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2,042

$0.312

-

-

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Corohmni

South Africa . 396 parts In-Stock

1+ parts

$0.347

100+ parts

-

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396

$0.347

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-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.358

100+ parts

-

1k+ parts

$0.344

10k+ parts

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100

$0.358

-

$0.344

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Vigor

Singapore . 329 parts In-Stock

1+ parts

$0.870

100+ parts

-

1k+ parts

-

10k+ parts

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329

$0.870

-

-

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AZTECH Wire

Italy . 376 parts In-Stock

1+ parts

$8.380

100+ parts

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376

$8.380

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Lixinc

USA . 14,994 parts In-Stock

1+ parts

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14,994

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QUARKTWIN TECHNOLOGY LTD

USA . 14,073 parts In-Stock

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14,073

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Perfect Parts

USA . 9,856 parts In-Stock

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9,856

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Kulean Microsystems

USA . 8,296 parts In-Stock

1+ parts

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8,296

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Microchip USA

USA . 6,305 parts In-Stock

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6,305

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Problanco Electronics

Mexico . 3,103 parts In-Stock

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3,103

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SupplyDigital Components

Austria . 2,841 parts In-Stock

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2,841

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Kepictronics

USA . 1,266 parts In-Stock

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1,266

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Metaverse IC Inc.

Canada . 1,266 parts In-Stock

1+ parts

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1,266

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iodParts Technologies Inc.

India . 1,210 parts In-Stock

1+ parts

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1,210

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Authorized Procurement Solutions

USA . 1,210 parts In-Stock

1+ parts

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1,210

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-

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GreenTree Electronics

Israel . 1,170 parts In-Stock

1+ parts

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1,170

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-

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TANS Electronics

Latvia . 895 parts In-Stock

1+ parts

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100+ parts

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895

-

-

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UHIMA Technologies

Türkiye . 869 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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869

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Technical Specifications

Multiplexers & Switches NCP337FCT2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCP337FCT2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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