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NCP1840Q8A6MNG

Onsemi

NCP1840Q8A6MNG by Onsemi

NCP1840Q8A6MNG by Onsemi is a SERIAL graphics display driver with 20 terminals, operating voltage range of 3.3V to 5.5V, and industrial temperature grade up to 85 °C. It is ideal for LED display applications requiring a max frequency of 0.4 MHz in a compact chip carrier package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,614 parts In-Stock

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3,614

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Digiode

USA . 641 parts In-Stock

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641

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,176 parts In-Stock

1+ parts

$12.930

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$12.930

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SupplyDigital Components

Austria . 6,100 parts In-Stock

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TANS Electronics

Latvia . 3,543 parts In-Stock

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Problanco Electronics

Mexico . 3,154 parts In-Stock

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Kulean Microsystems

USA . 1,087 parts In-Stock

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1,087

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Corohmni

South Africa . 419 parts In-Stock

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Corphita

USA . 414 parts In-Stock

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414

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Microchip USA

USA . 412 parts In-Stock

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UHIMA Technologies

Türkiye . 6 parts In-Stock

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Overview

Enhance your visual experience with the NCP1840Q8A6MNG by Onsemi, a top-tier manufacturer known for superior quality products. Designed for Graphics Display Drivers, this cutting-edge solution offers seamless SERIAL data input mode and operates at a wide temperature range from -40 to 85 °C. With a compact SQUARE package shape and surface mount feature, this LED DISPLAY DRIVER provides unparalleled performance in industrial applications. Elevate your display systems with the reliable and efficient NCP1840Q8A6MNG, delivering exceptional value and benefits to meet your diverse needs.

Feature Benefit Bullets

Data Input Mode: SERIAL

Serial data input mode allows for easy integration with microcontrollers and other digital systems.

Surface Mount: YES

Surface mount design saves space and allows for easy installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Wide operating voltage range ensures compatibility with various power sources.

Package Shape: SQUARE

Square package shape provides efficient use of board space.

Power Supplies (V): 3.4

Stable power supply voltage helps ensure reliable performance of the display driver.

No. of Terminals: 20

Sufficient number of terminals for connecting to other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package style options cater to different design requirements.

Minimum Supply Voltage: 3.3 V

Low minimum supply voltage enables operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in industrial environments without overheating.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance.

Terminal Position: QUAD

Quad terminal position offers multiple connection points for enhanced stability.

Maximum Seated Height: 1 mm

Low profile design saves space and allows for compact system integration.

Width: 4 mm

Narrow width enables placement in tight spaces on PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes thermal stress on the components during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering of the display driver onto the PCB.

Length: 4 mm

Compact length allows for flexible placement on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range makes this display driver suitable for harsh environments.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and avoids potential health hazards.

Nominal Supply Voltage: 3.6 V

Stable nominal supply voltage for consistent performance over time.

No. of Segments: 8

Suitable for driving displays with multiple segments for versatile applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB layouts and precise connections.

Minimum fmax: 0.4 MHz

High minimum operating frequency ensures fast refresh rates for the display segments.

Interface IC Type: LED DISPLAY DRIVER

Specific interface IC type optimized for driving LED display panels efficiently.

Technical Specifications

Graphics Display Drivers NCP1840Q8A6MNG attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.4

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Minimum fmax:

.4 MHz

Trade Compliance

NCP1840Q8A6MNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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