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NCP156AAFCT100280T2G

Onsemi

NCP156AAFCT100280T2G by Onsemi

NCP156AAFCT100280T2G by Onsemi is a Fixed Positive Multiple Output LDO Regulator with 2 outputs. It has a Max Dropout Voltage of 0.16V and 0.15V, suitable for applications requiring precise voltage regulation in compact spaces. This regulator operates within a temperature range of -40 to 125 °C, making it ideal for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,872 parts In-Stock

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Digiode

USA . 1,782 parts In-Stock

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Problanco Electronics

Mexico . 4,219 parts In-Stock

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Kulean Microsystems

USA . 1,785 parts In-Stock

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TANS Electronics

Latvia . 1,783 parts In-Stock

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SupplyDigital Components

Austria . 1,690 parts In-Stock

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Corphita

USA . 1,125 parts In-Stock

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UHIMA Technologies

Türkiye . 378 parts In-Stock

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Corohmni

South Africa . 108 parts In-Stock

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Overview

Experience seamless power regulation with the NCP156AAFCT100280T2G by Onsemi, a leading manufacturer known for its high-quality components. This fixed positive multiple output LDO regulator offers reliable performance and precise voltage control for a wide range of applications. From consumer electronics to industrial automation, this product ensures stable power supply with minimal dropout voltage, making it the ideal choice for your next project. Trust Onsemi to deliver top-notch quality and efficiency in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures a lightweight and durable construction.

Maximum Dropout Voltage-2: 2.16 V

The low maximum dropout voltage ensures efficient operation even when the input voltage is close to the output voltage.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on a PCB, saving valuable space.

Operating Temperature (TJ-Max): 125 °C

The high operating temperature range ensures reliable performance even in harsh environments.

Nominal Output Voltage-2: 2.8 V

The stable nominal output voltage of 2.8V ensures consistent power supply for connected components.

Operating Temperature (TJ-Min): -40 °C

The wide operating temperature range of -40C to 125 °C allows for flexibility in different operating conditions.

Maximum Voltage Tolerance: 2 %

The low maximum voltage tolerance of 2% ensures precise regulation of output voltages.

No. of Terminals: 6

Having 6 terminals enables easy connection and integration into existing circuitry.

Adjustability: FIXED

The fixed adjustability simplifies the design and eliminates the need for constant adjustments.

Maximum Output Current-1: 0.5 A

The high maximum output current rating of 0.5A allows for powering multiple components simultaneously.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO NCP156AAFCT100280T2G attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.15 V

Nominal Dropout Voltage-1:

.07 V

Maximum Dropout Voltage-2:

.16 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.3 V

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e3

Length:

1.2 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Current-2:

.25 A

Maximum Output Voltage-1:

1.018 V

Minimum Output Voltage-1:

.982 V

Nominal Output Voltage-1:

1 V

Maximum Output Voltage-2:

2.856 V

Minimum Output Voltage-2:

2.744 V

Nominal Output Voltage-2:

2.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,16

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

Packing Method:

TR

Maximum Seated Height:

.33 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

2 %

Width:

.8 mm

Trade Compliance

NCP156AAFCT100280T2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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