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NCP1117DT50

Onsemi

NCP1117DT50 by Onsemi

NCP1117DT50 by Onsemi is a fixed positive single output LDO regulator with 1A max output current and 5V nominal output voltage. It has a max dropout voltage of 1.2V, making it suitable for applications requiring stable voltage regulation in a compact form factor. Operating temperature range from -55 °C to 150°C ensures reliable performance in various environments.

Median Price

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Lifecycle Status

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4

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1k+

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Zilex Electronics Inc.

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AZTECH Wire

Italy . 993 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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TANS Electronics

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SupplyDigital Components

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Corphita

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Microchip USA

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Overview

Enhance your electronic designs with the reliable NCP1117DT50 fixed regulator by Onsemi. With a focus on quality and precision, Onsemi ensures that this LDO regulator delivers consistent performance in various applications. From powering sensors to audio circuits, this regulator offers stable output voltage and efficient power management. Trust Onsemi's expertise and the NCP1117DT50's superior features to elevate your projects to new heights. Choose reliability, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Maximum Dropout Voltage-1: 1.2 V

With a low maximum dropout voltage, this regulator can maintain stable output even when the input voltage drops.

Surface Mount: YES

The surface mount feature makes it easy to install and saves space on the PCB.

Operating Temperature (TJ-Max): 150 °C

The wide operating temperature range allows this regulator to perform reliably in various environmental conditions.

Technology: BIPOLAR

The bipolar technology ensures better performance and stability compared to other technologies.

Nominal Output Voltage-1: 5 V

The fixed nominal output voltage makes it suitable for applications requiring a consistent voltage supply.

Maximum Output Current-1: 1 A

With a high maximum output current, this regulator can power devices with higher power requirements.

Maximum Input Voltage Absolute: 20 V

The high maximum input voltage allows for flexibility in the input power source.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP1117DT50 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.2 V

Nominal Dropout Voltage-1:

1.07 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

15 V

Minimum Input Voltage:

6.5 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Length:

6.54 mm

Maximum Line Regulation:

.006 %

Maximum Load Regulation:

.015 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Voltage Tolerance:

2 %

Width:

6.095 mm

Trade Compliance

NCP1117DT50 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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