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NCP1117DT19RKG

Onsemi

NCP1117DT19RKG by Onsemi

NCP1117DT19RKG by Onsemi is a fixed positive single output LDO regulator with 1A max output current, 1.9V nominal output voltage, and 2% max voltage tolerance. It is ideal for applications requiring stable voltage regulation in a compact package, suitable for surface mount technology and operating temperatures ranging from -55 to 150 °C.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,813 parts In-Stock

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Digiode

USA . 2,454 parts In-Stock

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AZTECH Wire

Italy . 949 parts In-Stock

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$20.510

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949

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Kepictronics

USA . 27,860 parts In-Stock

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TANS Electronics

Latvia . 7,139 parts In-Stock

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Kulean Microsystems

USA . 6,841 parts In-Stock

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Problanco Electronics

Mexico . 3,404 parts In-Stock

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SupplyDigital Components

Austria . 1,451 parts In-Stock

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UHIMA Technologies

Türkiye . 961 parts In-Stock

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Corphita

USA . 937 parts In-Stock

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Vigor

Singapore . 714 parts In-Stock

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Corohmni

South Africa . 393 parts In-Stock

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Microchip USA

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Overview

Experience superior quality and reliability with the NCP1117DT19RKG by Onsemi, a leading manufacturer in the industry. This fixed positive single output LDO regulator offers unmatched performance and efficiency for a wide range of applications. With a compact design and high precision, this regulator guarantees stable power supply, minimizing dropout voltage and ensuring optimal operation. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NCP1117DT19RKG and enjoy seamless functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Maximum Dropout Voltage: 1.2 V

Low dropout voltage ensures efficient power conversion and minimal power dissipation.

Surface Mount: YES

Surface mount capability allows for easy and convenient PCB assembly.

Operating Temperature (TJ-Max): 150 °C

High maximum operating temperature range ensures reliable performance in a wide range of environments.

Technology: BIPOLAR

Bipolar technology offers stable and accurate voltage regulation for sensitive electronic components.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and easy soldering during assembly.

Operating Temperature (TJ-Min): -55 °C

Wide minimum operating temperature range allows for operation in extreme cold conditions.

Minimum Output Voltage: 1.862 V

Low minimum output voltage allows for precise voltage regulation in low power applications.

Maximum Voltage Tolerance: 2 %

Tight voltage tolerance ensures consistent output voltage under varying conditions.

Nominal Output Voltage: 1.9 V

Stable nominal output voltage suitable for a wide range of electronic devices.

No. of Terminals: 2

Simple two-terminal design for easy integration into circuits.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space on the PCB.

Adjustability: FIXED

Fixed output voltage eliminates the need for external adjustments, simplifying the design.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in normal operating conditions.

Terminal Pitch: 2.29 mm

Standard terminal pitch for easy mounting on the PCB.

Maximum Line Regulation: 0.0025 %

Low line regulation maintains a stable output voltage despite fluctuations in input voltage.

Minimum Operating Temperature: 0 °C

Wide minimum operating temperature range ensures reliable operation in various environments.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Fixed, positive output regulator with low dropout voltage ideal for applications requiring stable voltage supply.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance.

Terminal Position: SINGLE

Single terminal position for simple and hassle-free installation.

Maximum Output Voltage: 1.938 V

High maximum output voltage suitable for applications requiring higher voltage levels.

Maximum Seated Height: 2.38 mm

Low seated height for compact and space-saving designs.

Width: 6.095 mm

Narrow width facilitates easy integration into tight spaces on the PCB.

Maximum Load Regulation: 0.006 %

Low load regulation ensures stable output voltage under varying load conditions.

Minimum Input Voltage: 3.3 V

Low minimum input voltage requirement suitable for powering from various sources.

Maximum Output Current: 1 A

High maximum output current capability for powering a range of electronic components.

Peak Reflow Temperature °C: 260

High peak reflow temperature for lead-free soldering in manufacturing processes.

Nominal Dropout Voltage: 1.07 V

Low nominal dropout voltage for efficient power conversion and minimal heat dissipation.

Length: 6.54 mm

Compact length for space-efficient PCB layouts and designs.

Maximum Input Voltage: 11.9 V

High maximum input voltage handling capability suitable for a variety of power sources.

Maximum Input Voltage Absolute: 20 V

Wide absolute maximum input voltage range for enhanced protection against overvoltage conditions.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP1117DT19RKG attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.2 V

Nominal Dropout Voltage-1:

1.07 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

11.9 V

Minimum Input Voltage:

3.3 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

Maximum Line Regulation:

.0025 %

Maximum Load Regulation:

.006 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

1.938 V

Minimum Output Voltage-1:

1.862 V

Nominal Output Voltage-1:

1.9 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Voltage Tolerance:

2 %

Width:

6.095 mm

Trade Compliance

NCP1117DT19RKG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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