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NCN5150MNG

Onsemi

NCN5150MNG by Onsemi

The Onsemi NCN5150MNG is a Line Transceiver IC with 20 terminals, operating at 3.3V. It features a max output low current of 1.1A and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring high-speed data transmission in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 42,000 parts In-Stock

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42,000

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Digiode

USA . 2,207 parts In-Stock

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2,207

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Vyrian

USA . 439 parts In-Stock

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439

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 297 parts In-Stock

1+ parts

$12.640

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297

$12.640

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AZTECH Wire

Italy . 391 parts In-Stock

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$19.231

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391

$19.231

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Ampacity Inc.

Singapore . 885 parts In-Stock

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$33.500

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885

$33.500

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Semicontronic

India . 1,317 parts In-Stock

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$46.500

100+ parts

$45.338

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$45.105

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1,317

$46.500

$45.338

$45.105

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SupplyDigital Components

Austria . 7,809 parts In-Stock

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TANS Electronics

Latvia . 6,361 parts In-Stock

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6,361

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Kulean Microsystems

USA . 6,093 parts In-Stock

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6,093

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Problanco Electronics

Mexico . 3,613 parts In-Stock

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Corphita

USA . 1,595 parts In-Stock

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1,595

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Continental Prestige Electronics

USA . 1,435 parts In-Stock

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1,435

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Corohmni

South Africa . 479 parts In-Stock

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479

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UHIMA Technologies

Türkiye . 340 parts In-Stock

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340

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Argo Parts USA

USA . 312 parts In-Stock

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312

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the power of seamless communication with the NCN5150MNG by Onsemi. As a leader in line drivers and receivers, Onsemi's commitment to quality shines through in every aspect of this product. From its durable plastic/epoxy package body to its reliable tin terminal finish, this chip carrier is designed for industrial-grade performance. With a nominal supply voltage of 3.3V and maximum output low current of 1.1A, this line transceiver offers unparalleled value and benefits to customers in a wide range of applications. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and easy handling.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuits or PCBs, saving space and simplifying assembly.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes it compatible with a wide range of systems and circuits without the need for additional voltage conversion.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand and function in various environmental conditions without any performance issues.

Minimum Operating Temperature: -40 °C

The product's ability to operate efficiently even at extremely low temperatures down to -40°C ensures reliable performance in diverse applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power delivery to the device, leading to reliable and consistent operation.

Technical Specifications

Line Drivers & Receivers NCN5150MNG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Interface IC Type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

1.1 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.5 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NCN5150MNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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