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NCL30167DR2G

Onsemi

NCL30167DR2G by Onsemi

NCL30167DR2G by Onsemi is a Graphics Display Driver with 10 terminals, operating temperature range of -40 to 125 °C. It has a supply voltage of 13V and supports LED display driver interface IC type. Ideal for automotive applications due to its small outline package style and matte tin terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,823 parts In-Stock

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Digiode

USA . 2,348 parts In-Stock

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AZTECH Wire

Italy . 1,110 parts In-Stock

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$8.360

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Component Stockers USA

USA . 398 parts In-Stock

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$99.990

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398

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SupplyDigital Components

Austria . 7,168 parts In-Stock

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Problanco Electronics

Mexico . 6,719 parts In-Stock

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TANS Electronics

Latvia . 4,941 parts In-Stock

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Corphita

USA . 2,080 parts In-Stock

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Kulean Microsystems

USA . 793 parts In-Stock

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Microchip USA

USA . 475 parts In-Stock

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UHIMA Technologies

Türkiye . 255 parts In-Stock

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Corohmni

South Africa . 143 parts In-Stock

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Overview

Enhance your display performance with the NCL30167DR2G by Onsemi, a top-quality graphics display driver designed to meet the highest industry standards. With Onsemi's reputation for reliability and innovation, this product offers unmatched value and benefits to customers looking to optimize their visual experience. Ideal for a wide range of applications in automotive and industrial settings, this LED display driver provides seamless integration and outstanding results. Upgrade your display capabilities today with the NCL30167DR2G from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on PCBs, reducing assembly time.

No. of Terminals: 10

Having 10 terminals provides flexibility in connecting to external circuitry and components.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in various environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and corrosion resistance for a reliable connection.

Width: 3.9 mm

Narrow width makes the package compact and space-efficient in electronic designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the driver can withstand the harsh conditions of automotive environments.

Nominal Supply Voltage: 13 V

Suitable nominal supply voltage for driving LED displays with optimal performance.

Technical Specifications

Graphics Display Drivers NCL30167DR2G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Segments:

6

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NCL30167DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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