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NCL30125B1DR2G

Onsemi

NCL30125B1DR2G by Onsemi

NCL30125B1DR2G by Onsemi is a switching controller with a 12V nominal voltage and 1000 kHz max switching frequency. It is designed for automotive applications, featuring a small outline package style and operating temperature range from -40 to 125 °C. With 14 terminals in a rectangular shape, this surface-mount device offers current-mode control for efficient power regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,983 parts In-Stock

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Vyrian

USA . 1,227 parts In-Stock

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1,227

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,982 parts In-Stock

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7,982

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Kulean Microsystems

USA . 5,784 parts In-Stock

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5,784

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TANS Electronics

Latvia . 3,350 parts In-Stock

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3,350

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SupplyDigital Components

Austria . 1,818 parts In-Stock

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Corphita

USA . 1,036 parts In-Stock

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1,036

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UHIMA Technologies

Türkiye . 553 parts In-Stock

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553

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Corohmni

South Africa . 211 parts In-Stock

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Overview

Experience the next level of efficiency and reliability with the NCL30125B1DR2G by Onsemi, a cutting-edge switching regulator & controller that offers unparalleled performance in various applications. Manufactured by Onsemi, a trusted name in the industry, this innovative product boasts a compact design and advanced features that make it ideal for automotive-grade solutions. With a wide operating temperature range and high switching frequency, this product ensures optimal performance and durability. Say goodbye to inefficiencies and embrace the future of power management with the NCL30125B1DR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate into electronic circuit boards, saving space and enabling efficient assembly.

Nominal Supply Voltage (Vsup): 12 V

Suitable for applications requiring a 12V power supply, providing compatibility with a wide range of devices.

Control Mode: CURRENT-MODE

Current-mode control provides better transient response and simplifies loop compensation, enhancing overall performance of the regulator.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability in various environmental conditions, making it suitable for demanding applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the regulator to function in extreme cold conditions, enhancing its versatility.

Maximum Switching Frequency: 1000 kHz

High switching frequency enables fast response and efficient power conversion, making the regulator suitable for high-performance applications.

Technical Specifications

Switching Regulators & Controllers NCL30125B1DR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G14

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14/16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Maximum Switching Frequency:

1000 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

NCL30125B1DR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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