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NCL30125A1DR2G

Onsemi

NCL30125A1DR2G by Onsemi

NCL30125A1DR2G by Onsemi is a switching controller with a 12V nominal voltage and 1000 kHz max switching frequency. Ideal for automotive applications, this IC operates b/w -40 to 125 °C, features a small outline package style, and offers current-mode control for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,049 parts In-Stock

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Digiode

USA . 1,127 parts In-Stock

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1,127

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TANS Electronics

Latvia . 6,910 parts In-Stock

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Kulean Microsystems

USA . 6,776 parts In-Stock

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Problanco Electronics

Mexico . 5,698 parts In-Stock

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SupplyDigital Components

Austria . 5,515 parts In-Stock

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UHIMA Technologies

Türkiye . 907 parts In-Stock

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Corphita

USA . 489 parts In-Stock

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Corohmni

South Africa . 355 parts In-Stock

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Overview

Unleash the power of efficient energy management with the NCL30125A1DR2G by Onsemi. Crafted with precision and reliability, this switching regulator offers unparalleled performance in a compact package. Ideal for automotive applications, this innovative product ensures optimal power distribution with current-mode control and a wide temperature range. Experience seamless operation and enhanced functionality with Onsemi's cutting-edge technology, setting new standards in the industry. Elevate your projects with the NCL30125A1DR2G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and reliability.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage is commonly used in many electronic applications, making this product compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand harsh environments and extended use without overheating.

Control Mode: CURRENT-MODE

The current-mode control mode offers efficient regulation and precise adjustment of output current, providing stable performance under varying load conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for reliable operation in cold climates or industrial settings where temperatures may drop significantly.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures that the product meets rigorous standards for reliability and performance in automotive applications.

Maximum Switching Frequency: 1000 kHz

The high maximum switching frequency of 1000 kHz enables fast response times and high efficiency in power conversion, making this product suitable for demanding applications.

Technical Specifications

Switching Regulators & Controllers NCL30125A1DR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G14

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14/16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Maximum Switching Frequency:

1000 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

NCL30125A1DR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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