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NCL30083BDR2G

Onsemi

NCL30083BDR2G by Onsemi

NCL30083BDR2G by Onsemi is a Graphics Display Driver with 8 terminals, operating temperature range of -40 to 125 °C, and nominal voltage of 12V. It is used in automotive applications for LED display driving due to its small outline package style and matte tin terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,598 parts In-Stock

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3,598

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Digiode

USA . 1,703 parts In-Stock

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1,703

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Distributors (Availability)

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AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$22.150

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763

$22.150

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TANS Electronics

Latvia . 5,606 parts In-Stock

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Kulean Microsystems

USA . 4,906 parts In-Stock

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Problanco Electronics

Mexico . 4,791 parts In-Stock

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4,791

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SupplyDigital Components

Austria . 2,598 parts In-Stock

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Corphita

USA . 2,249 parts In-Stock

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2,249

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UHIMA Technologies

Türkiye . 638 parts In-Stock

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638

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Corohmni

South Africa . 300 parts In-Stock

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Microchip USA

USA . 281 parts In-Stock

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Overview

Enhance your display performance with the NCL30083BDR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This graphics display driver is perfect for a wide range of applications, offering superior value and benefits to customers. Experience seamless operation and enhanced visuals with this innovative product, designed to meet all your display driver needs. Choose Onsemi for cutting-edge technology and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in reducing overall weight of the product.

Surface Mount: YES

Surface mount capability makes installation easy and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular shape offers efficient use of space on the PCB.

No. of Terminals: 8

Having 8 terminals allows for connectivity to various components in the system.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables operation in cold environments.

Terminal Finish: MATTE TIN

Matte Tin finish provides good conductivity and solderability.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout.

Maximum Seated Height: 1.1 mm

Low seated height helps in reducing overall height of the product, making it suitable for compact designs.

Width: 3 mm

Narrow width helps in saving space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering of the components.

Length: 3 mm

Short length helps in keeping the product compact.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability in operation in automotive applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and solder joint reliability.

Nominal Supply Voltage: 12 V

Voltage rating of 12V makes it compatible with standard power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Interface IC Type: LED DISPLAY DRIVER

Specifically designed for LED display drivers, ensuring optimal performance and compatibility.

Technical Specifications

Graphics Display Drivers NCL30083BDR2G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCL30083BDR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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