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NCH-RSL10-101WC51-ABG

Onsemi

NCH-RSL10-101WC51-ABG by Onsemi

NCH-RSL10-101WC51-ABG by Onsemi is a Telecom IC with 2Mbps data rate. It operates b/w -40 to 85°C, has 51 terminals in a thin profile grid array package. Ideal for telecom circuits due to its low supply voltage and fine pitch design.

Median Price

$5.168

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,672 parts In-Stock

1+ parts

$4.710

100+ parts

$4.351

1k+ parts

$4.212

10k+ parts

-

4,672

$4.710

$4.351

$4.212

-

DigiKey

USA . 2,275 parts In-Stock

1+ parts

$8.230

100+ parts

$6.238

1k+ parts

$5.508

10k+ parts

$5.062

2,275

$8.230

$6.238

$5.508

$5.062

Mouser Electronics

USA . 497 parts In-Stock

1+ parts

$8.230

100+ parts

$6.080

1k+ parts

$4.960

10k+ parts

$4.770

497

$8.230

$6.080

$4.960

$4.770

Rochester

USA . 13,538 parts In-Stock

1+ parts

-

100+ parts

$4.500

1k+ parts

$4.030

10k+ parts

$3.790

13,538

-

$4.500

$4.030

$3.790

Verical

USA . 8,538 parts In-Stock

1+ parts

-

100+ parts

$5.625

1k+ parts

$5.037

10k+ parts

$4.737

8,538

-

$5.625

$5.037

$4.737

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.330

5,000

-

-

-

$4.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,539 parts In-Stock

1+ parts

$4.312

100+ parts

-

1k+ parts

-

10k+ parts

-

1,539

$4.312

-

-

-

Digiode

USA . 1,013 parts In-Stock

1+ parts

$4.750

100+ parts

-

1k+ parts

-

10k+ parts

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1,013

$4.750

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 190 parts In-Stock

1+ parts

$4.312

100+ parts

-

1k+ parts

-

10k+ parts

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190

$4.312

-

-

-

Corphita

USA . 2,448 parts In-Stock

1+ parts

$4.500

100+ parts

-

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-

10k+ parts

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2,448

$4.500

-

-

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$8.356

100+ parts

$7.604

1k+ parts

$6.852

10k+ parts

-

450

$8.356

$7.604

$6.852

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Perfect Parts

USA . 182,881 parts In-Stock

1+ parts

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182,881

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Lixinc

USA . 10,615 parts In-Stock

1+ parts

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10,615

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Kulean Microsystems

USA . 7,075 parts In-Stock

1+ parts

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7,075

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Problanco Electronics

Mexico . 6,134 parts In-Stock

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6,134

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TANS Electronics

Latvia . 4,210 parts In-Stock

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4,210

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SupplyDigital Components

Austria . 1,751 parts In-Stock

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1,751

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GreenTree Electronics

Israel . 824 parts In-Stock

1+ parts

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824

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UHIMA Technologies

Türkiye . 89 parts In-Stock

1+ parts

-

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89

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Overview

Elevate your telecom interface solutions with the NCH-RSL10-101WC51-ABG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. This cutting-edge telecom IC is perfect for a wide range of applications, providing seamless connectivity and high-speed data transfer. With its advanced features and industrial-grade temperature range, this product offers exceptional value and performance to customers looking for reliable and efficient telecom solutions. Upgrade your telecommunications systems today with the NCH-RSL10-101WC51-ABG!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology makes the product easy to mount on PCBs, saving space and allowing for automated assembly.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB.

No. of Terminals: 51

51 terminals provide ample connectivity options for various telecom interfaces and functions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in wide temperature ranges.

Terminal Finish: TIN SILVER

Tin silver terminal finish enhances conductivity and corrosion resistance.

Width: 2.325 mm

Narrow width saves space on the PCB, especially in applications where space is limited.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in harsh industrial environments.

Data Rate: 2 Mbps

High data rate of 2 Mbps enables fast and efficient data transmission in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs NCH-RSL10-101WC51-ABG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

Data Rate:

2 Mbps

JESD-30 Code:

R-PBGA-B51

JESD-609 Code:

e2

Length:

2.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

51

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA51,11X11,10

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.381 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.252 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.325 mm

Trade Compliance

NCH-RSL10-101WC51-ABG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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