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NCH-RSL10-01S51-ACG

Onsemi

NCH-RSL10-01S51-ACG by Onsemi

NCH-RSL10-01S51-ACG by Onsemi is a telecom IC with 51 terminals, operating temperature range of -40 to 85 °C, and data rate of 4 Mbps. It is a surface-mount chip carrier suitable for industrial applications requiring a nominal voltage of 1.25V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,417 parts In-Stock

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Digiode

USA . 94 parts In-Stock

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Kulean Microsystems

USA . 5,006 parts In-Stock

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5,006

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Corphita

USA . 2,053 parts In-Stock

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TANS Electronics

Latvia . 1,840 parts In-Stock

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Problanco Electronics

Mexico . 1,560 parts In-Stock

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SupplyDigital Components

Austria . 351 parts In-Stock

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Corohmni

South Africa . 305 parts In-Stock

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UHIMA Technologies

Türkiye . 75 parts In-Stock

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Overview

Discover the cutting-edge NCH-RSL10-01S51-ACG by Onsemi, a superior product in the category of Other Function Telecom Interface ICs. Onsemi's reputation for top-quality manufacturing shines through in this innovative chip carrier package, offering customers unmatched reliability and performance. With a wide range of applications, from telecommunications to industrial settings, this product brings value and benefits that exceed expectations. Experience the advantages of seamless integration, high efficiency, and exceptional durability with the NCH-RSL10-01S51-ACG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

No. of Terminals: 51

Having 51 terminals provides ample connectivity options for various functions and interfaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand extended operation in various environments.

Width: 6 mm

Compact width makes it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Designed for industrial use, ensuring reliability and performance in demanding conditions.

Technical Specifications

Other Function Telecom Interface ICs NCH-RSL10-01S51-ACG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

Data Rate:

4 Mbps

JESD-30 Code:

R-PBCC-B51

Length:

8 mm

No. of Functions:

1

No. of Terminals:

51

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.56 mm

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.7 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

NCH-RSL10-01S51-ACG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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