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NC7SZ05P5X-L22057

Onsemi

NC7SZ05P5X-L22057 by Onsemi

The Onsemi NC7SZ05P5X-L22057 is a CMOS Logic Gate with 11ns Propagation Delay, 1.8V Nominal Voltage, and 32A Max I (ol). Ideal for applications requiring fast signal processing in compact spaces due to its small outline package style and open-drain output characteristics.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 33 parts In-Stock

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$0.430

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$0.196

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$0.430

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Nova Conductors

Japan . 10 parts In-Stock

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$0.102

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Digiode

USA . 1,308 parts In-Stock

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$0.408

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Component Sense

UK . 38,403 parts In-Stock

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IBS Electronics

USA . 21,000 parts In-Stock

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Vyrian

USA . 3,378 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Corohmni

South Africa . 143 parts In-Stock

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$0.100

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Netroflash

USA . 1,000 parts In-Stock

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$0.102

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$0.097

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$0.094

1,000

$0.102

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$0.094

Ampacity Inc.

Singapore . 33 parts In-Stock

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$0.365

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Corphita

USA . 1,771 parts In-Stock

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$0.387

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AZTECH Wire

Italy . 525 parts In-Stock

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$16.938

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Kulean Microsystems

USA . 7,480 parts In-Stock

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Microchip USA

USA . 3,210 parts In-Stock

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TANS Electronics

Latvia . 3,062 parts In-Stock

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Problanco Electronics

Mexico . 2,183 parts In-Stock

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SupplyDigital Components

Austria . 2,075 parts In-Stock

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UHIMA Technologies

Türkiye . 987 parts In-Stock

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Overview

Unleash the power of efficient logic gates with the NC7SZ05P5X-L22057 by Onsemi. Crafted with precision and expertise, this small outline, thin profile chip offers lightning-fast propagation delay and a maximum I (ol) of 32 Amp, perfect for a wide range of applications. From consumer electronics to industrial automation, this versatile component delivers unmatched performance and reliability. Elevate your projects with the quality and innovation only Onsemi can provide. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this logic gate lightweight and durable.

Propagation Delay At Nominal Supply: 11 ns

This low propagation delay ensures fast performance of the logic gate.

Surface Mount: YES

Being surface mountable makes it easier to integrate into electronic circuits.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, suitable for low-power applications.

Load Capacitance (CL): 50 pF

Suitable for driving loads with a capacitance of up to 50 pF.

No. of Terminals: 5

Simple and straightforward to connect in circuits.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Technical Specifications

Logic Gates NC7SZ05P5X-L22057 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

13.4 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

NC7SZ05P5X-L22057 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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