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NC7ST86P5X-L22057

Onsemi

NC7ST86P5X-L22057 by Onsemi

The Onsemi NC7ST86P5X-L22057 is a CMOS Logic Gate with 2 inputs, 33ns propagation delay at 5V. It has a small outline package style and operates b/w -40 to 85°C. Ideal for applications requiring fast signal processing in compact designs.

Median Price

$0.013

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,000 parts In-Stock

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$0.013

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$0.013

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Digiode

USA . 1,318 parts In-Stock

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$0.072

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$0.072

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Nova Conductors

Japan . 93 parts In-Stock

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$0.115

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Flip Electronics

USA . 153,000 parts In-Stock

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Vyrian

USA . 6,947 parts In-Stock

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Ampacity Inc.

Singapore . 4,004 parts In-Stock

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$0.065

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4,004

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Corphita

USA . 2,193 parts In-Stock

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$0.068

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2,193

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Corohmni

South Africa . 251 parts In-Stock

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$0.076

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251

$0.076

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Microchip USA

USA . 8,095 parts In-Stock

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$0.548

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$0.548

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AZTECH Wire

Italy . 41 parts In-Stock

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$20.450

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41

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TANS Electronics

Latvia . 5,906 parts In-Stock

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Problanco Electronics

Mexico . 4,133 parts In-Stock

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Kulean Microsystems

USA . 3,132 parts In-Stock

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SupplyDigital Components

Austria . 1,526 parts In-Stock

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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Bastille Electronics

Australia . 600 parts In-Stock

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Overview

Enhance your electronic projects with the NC7ST86P5X-L22057 by Onsemi, a top-tier manufacturer known for quality and reliability. This logic gate offers fast propagation delay and low power consumption, making it ideal for a wide range of applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, this product provides the performance and efficiency you need to bring your designs to life. Trust Onsemi to deliver cutting-edge technology that empowers your creations and drives innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the logic gates, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 33 ns

Fast propagation delay ensures quick signal processing and response times, making it suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with a wide range of electronic devices and systems.

No. of Inputs: 2

Having 2 inputs allows for versatile logic operations and compatibility with various circuit configurations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates NC7ST86P5X-L22057 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HST/T

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

33 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NC7ST86P5X-L22057 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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