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NBXDPA012LNHTAG

Onsemi

NBXDPA012LNHTAG by Onsemi

NBXDPA012LNHTAG by Onsemi is a LVDS XO Clock Oscillator with 106.25 MHz frequency, 50% stability, and 3.63 V max supply voltage. Ideal for applications requiring precise timing in temperature-sensitive environments due to its wide operating range (-40 °C to 85°C) and small form factor (7.0mm x 5.0mm x 1.9mm).

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Vyrian

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USA . 1,424 parts In-Stock

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AZTECH Wire

Italy . 712 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,560 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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Corphita

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TANS Electronics

Latvia . 1,902 parts In-Stock

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UHIMA Technologies

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Microchip USA

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Overview

Enhance your electronic devices with the NBXDPA012LNHTAG by Onsemi, a top-tier manufacturer known for producing high-quality XO Clock Oscillators. Perfect for applications requiring precise timing and synchronization, this oscillator boasts a 50% frequency stability and an LVDS type design. With a nominal operating frequency of 106.25 MHz and a compact physical dimension of 7.0mm x 5.0mm x 1.9mm, this product offers unmatched performance and reliability. Upgrade your technology with the NBXDPA012LNHTAG and experience seamless operation and enhanced efficiency like never before.

Feature Benefit Bullets

Frequency Stability: 50%

Offers good stability in frequency, ensuring accurate timekeeping in the clock.

Maximum Supply Voltage: 3.63 V

Allows for flexibility in power supply options without risking damage to the oscillator.

Output Load: 100 OHM

Suitable for driving standard loads, providing compatibility with various circuit configurations.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a standard supply voltage commonly found in electronic systems.

Oscillator Type: LVDS

Utilizes Low Voltage Differential Signaling for high-speed, low-power clock signal transmission.

No. of Terminals: 6

Provides sufficient connectivity options for integration into different circuit designs.

Maximum Rise Time: 0.4 ms

Offers fast rise times for quick signal transitions, enhancing overall system performance.

Physical Dimension: 7.0mm x 5.0mm x 1.9mm

Compact size enables easy integration into space-constrained electronic devices.

Minimum Supply Voltage: 2.97 V

Can operate at lower supply voltages, increasing compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Capable of functioning reliably in extreme temperature environments.

Nominal Operating Frequency: 106.25 MHz

Provides a high operating frequency for precision timing applications.

Maximum Fall Time: 0.4 ns

Ensures fast fall times for quick signal transitions, maintaining signal integrity.

Maximum Symmetry (%): 52/48

Delivers balanced output waveforms with equal high and low durations for accurate clock signal generation.

Mounting Feature: SURFACE MOUNT

Facilitates easy and secure mounting on PCBs, simplifying the assembly process.

Technical Specifications

XO Clock Oscillators NBXDPA012LNHTAG attributes and parameters. Explore more XO Clock Oscillators devices from Onsemi

Specs

Additional Features:

VOLTAGE 2.5 AND FREQ 212.5 MHZ POSSIBLE; TRI-STATE; E/D FUNCTION; DIFFERENTIAL O/P; TAPE AND REEL

Maximum Fall Time:

.4 ns

Frequency Adjustment (Mechanical):

NO

Frequency Stability:

Mounting Feature:

No. of Terminals:

6

Nominal Operating Frequency:

106.25 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Oscillator Type:

Output Load:

100 OHM

Physical Dimension:

7.0mm x 5.0mm x 1.9mm

Maximum Rise Time:

.4 ms

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Maximum Symmetry (%):

52/48

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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