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NBVSPA042LU1TAG

Onsemi

NBVSPA042LU1TAG by Onsemi

NBVSPA042LU1TAG by Onsemi is a VCXO Clock Oscillator with LVDS type, operating at frequencies b/w 60-700 MHz. It features a frequency stability of 50%, ceramic package material, and dimensions of 5.0mm x 3.2mm x 1.35mm. Ideal for applications requiring precise timing control in electronic systems with a supply voltage range of 2.97-3.63 V and operating temperatures from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,950 parts In-Stock

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Digiode

USA . 485 parts In-Stock

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Problanco Electronics

Mexico . 8,184 parts In-Stock

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SupplyDigital Components

Austria . 7,231 parts In-Stock

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Kulean Microsystems

USA . 5,658 parts In-Stock

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TANS Electronics

Latvia . 3,247 parts In-Stock

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Corphita

USA . 2,137 parts In-Stock

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Corohmni

South Africa . 389 parts In-Stock

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UHIMA Technologies

Türkiye . 114 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NBVSPA042LU1TAG by Onsemi, a premium VCXO Clock Oscillator crafted from high-quality ceramic materials. With a frequency stability of 50% and a wide operating temperature range, this oscillator delivers reliable and precise timing for a variety of applications. Trust in Onsemi's expertise and experience in manufacturing top-notch components to ensure optimal performance and longevity. Upgrade your systems today with the NBVSPA042LU1TAG and experience the difference in quality and efficiency that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and stability, making the oscillator reliable and durable.

Frequency Stability: 50%

High frequency stability ensures consistent and accurate timing which is crucial for many applications.

Maximum Supply Voltage: 3.63 V

Allows for a wide range of supply voltage options, providing flexibility in different circuit designs.

Output Load: 100 OHM

Suitable for driving standard loads, ensuring compatibility with various systems.

Oscillator Type: LVDS

Low Voltage Differential Signaling (LVDS) offers high-speed data transmission and noise immunity, ideal for demanding communication systems.

Nominal Operating Frequency: 74.25 MHz

Operating at a high frequency allows for precise timing and synchronization in digital systems.

Maximum Operating Frequency: 700 MHz

Capable of operating at high frequencies, making it suitable for applications requiring fast data processing.

Mounting Feature: SURFACE MOUNT

Surface mount packaging allows for easy and efficient integration onto PCBs, saving space and enabling automated assembly.

Technical Specifications

VCXO Clock Oscillators NBVSPA042LU1TAG attributes and parameters. Explore more VCXO Clock Oscillators devices from Onsemi

Specs

Additional Features:

TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE AND REEL

Maximum Control Voltage:

2.65 V

Minimum Control Voltage:

.65 V

Maximum Fall Time:

.4 ns

Frequency Adjustment (Mechanical):

NO

Frequency Deviation or Pullability:

100 ppm

Frequency Stability:

Linearity:

10 %

Mounting Feature:

No. of Terminals:

6

Maximum Operating Frequency:

700 MHz

Minimum Operating Frequency:

60 MHz

Nominal Operating Frequency:

74.25 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Oscillator Type:

Output Load:

100 OHM

Package Body Material:

CERAMIC

Package Equivalence Code:

SOLCC6,.12

Physical Dimension:

5.0mm x 3.2mm x 1.35mm

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Rise Time:

.4 ms

Sub-Category:

Other Oscillators

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Maximum Symmetry (%):

55/45

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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