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NB4L858MFAR2G

Onsemi

NB4L858MFAR2G by Onsemi

NB4L858MFAR2G by Onsemi is a 32-terminal multiplexer with a supply voltage range of 2.3V to 3.6V, operating b/w -40 °C to 85°C. This IC features a low-profile flatpack package and is ideal for industrial applications requiring cross-point switching in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,988 parts In-Stock

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Digiode

USA . 1,939 parts In-Stock

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AZTECH Wire

Italy . 382 parts In-Stock

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$20.030

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Component Stockers USA

USA . 233 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 8,254 parts In-Stock

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Problanco Electronics

Mexico . 8,031 parts In-Stock

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Kulean Microsystems

USA . 4,908 parts In-Stock

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TANS Electronics

Latvia . 2,063 parts In-Stock

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Corphita

USA . 1,552 parts In-Stock

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UHIMA Technologies

Türkiye . 719 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 102 parts In-Stock

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Overview

Enhance your electronic designs with the NB4L858MFAR2G by Onsemi. Crafted with precision and expertise, this multiplexer & switch boasts top-notch quality and reliability. Perfect for a wide range of applications, this product offers unparalleled value to customers looking for seamless functionality and performance. With its cutting-edge technology and low profile design, the NB4L858MFAR2G delivers exceptional benefits and advantages that will take your projects to the next level. Choose Onsemi for superior innovation and excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the multiplexer, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 3.3 V

3.3V supply voltage is common and widely available, ensuring compatibility with many existing systems and components.

No. of Terminals: 32

32 terminals provide ample connectivity options for connecting multiple input and output devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the multiplexer to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the multiplexer can still operate in cold environments without issues.

Width (mm): 7 mm

Compact width of 7mm allows for easy integration into tight spaces and crowded PCB layouts.

No. of Channels: 2

2 channels provide the flexibility to switch between different input/output sources easily.

Technical Specifications

Multiplexers & Switches NB4L858MFAR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 2.5V SUPPLY

Other IC type:

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

NB4L858MFAR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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