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MURS480ET3G

Onsemi

MURS480ET3G by Onsemi

MURS480ET3G by Onsemi is a single diode with 0.1 us reverse recovery time, 800V peak reverse voltage, and 4A output current. Ideal for ultra-fast recovery power applications with an operating temperature range of -65 to 175°C. Package style is small outline, surface mountable in plastic/epoxy material.

Median Price

$0.686

Lifecycle Status

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21

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1k+

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Arrow

USA . 816 parts In-Stock

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$0.739

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$0.572

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$0.524

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816

$0.739

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$0.524

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Newark

USA . 3,641 parts In-Stock

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$1.060

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$0.671

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$0.607

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3,641

$1.060

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Mouser Electronics

USA . 29,833 parts In-Stock

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$2.030

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$0.740

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$2.030

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DigiKey

USA . 5,321 parts In-Stock

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$2.030

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$0.868

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$0.629

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5,321

$2.030

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$0.629

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Chip1Stop

Japan . 2,500 parts In-Stock

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$0.527

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$0.527

Master Electronics

USA . 2,200 parts In-Stock

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$0.460

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$0.438

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$0.419

2,200

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$0.460

$0.438

$0.419

Verical

USA . 2,200 parts In-Stock

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$0.571

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$0.571

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Farnell

UK . 1,390 parts In-Stock

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$0.633

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$0.457

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Distributors (In-Stock)

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Nova Conductors

Japan . 75 parts In-Stock

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$0.555

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75

$0.555

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Digiode

USA . 1,915 parts In-Stock

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$1.119

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Bristol Electronics

USA . 60 parts In-Stock

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$1.425

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$0.570

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60

$1.425

$0.570

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TME

Poland . 2,498 parts In-Stock

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$1.900

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$0.661

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$0.627

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2,498

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Chip Stock

USA . 18,600 parts In-Stock

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Component Sense

UK . 9,384 parts In-Stock

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NAC Semi

USA . 5,000 parts In-Stock

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$0.715

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Sensible Micro Corp

USA . 4,026 parts In-Stock

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Vyrian

USA . 2,617 parts In-Stock

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Dan-Mar Components

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IBS Electronics

USA . 2,200 parts In-Stock

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$0.645

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$0.615

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$0.588

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$0.645

$0.615

$0.588

LIBRA Elektronik GmbH

Germany . 534 parts In-Stock

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534

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Mil-Aero Solutions, Inc.

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,036 parts In-Stock

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$0.043

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$0.043

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Advanced Electronics

New Zealand . 21 parts In-Stock

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$0.154

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$0.147

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$0.147

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21

$0.154

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$0.147

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Ampacity Inc.

Singapore . 2,570 parts In-Stock

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$0.397

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2,570

$0.397

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Semicontronic

India . 2,182 parts In-Stock

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$0.397

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$0.387

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$0.385

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Corohmni

South Africa . 197 parts In-Stock

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$0.465

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Aranea Global

USA . 100 parts In-Stock

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$0.544

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$0.522

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100

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$0.522

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Continental Prestige Electronics

USA . 5,097 parts In-Stock

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$0.555

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$0.544

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Argo Parts USA

USA . 3,160 parts In-Stock

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$0.555

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$0.538

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Corphita

USA . 340 parts In-Stock

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iodParts Technologies Inc.

India . 500,000 parts In-Stock

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RC Electronics

USA . 91,256 parts In-Stock

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$0.570

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$0.520

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Robosynatics

Brazil . 22,835 parts In-Stock

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$0.115

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$0.112

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$0.112

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Lucentia Tech

USA . 22,835 parts In-Stock

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$0.115

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$0.112

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$0.112

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Lixinc

USA . 17,336 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 7,950 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 6,356 parts In-Stock

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Kulean Microsystems

USA . 6,218 parts In-Stock

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TANS Electronics

Latvia . 5,864 parts In-Stock

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UHIMA Technologies

Türkiye . 514 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the MURS480ET3G diode by Onsemi. This innovative product offers ultra-fast recovery power, making it ideal for a wide range of applications. With a maximum operating temperature of 175°C and a maximum repetitive peak reverse voltage of 800V, this diode is designed to deliver top-notch performance in any situation. Trust Onsemi's expertise in diodes and rectifiers to provide you with a product that exceeds expectations and adds value to your projects. Upgrade to the MURS480ET3G today and experience the benefits firsthand!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the diode, ensuring it remains reliable and long-lasting.

Config: SINGLE

Single configuration makes the diode easy to use and integrate into various circuits without complicating the setup.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying manufacturing processes.

Maximum Reverse Recovery Time: 0.1 us

Ultra-fast reverse recovery time ensures efficient operation and minimizes switching losses in high-frequency applications.

Package Shape: RECTANGULAR

Rectangular shape offers a standard and ergonomic design for easy handling and mounting in electronic devices.

No. of Terminals: 2

Having two terminals simplifies the connection and installation process, making it user-friendly for both professionals and hobbyists.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCBs, allowing for compact designs and efficient use of board real estate.

Application: ULTRA FAST RECOVERY POWER

Designed for ultra-fast recovery power applications, ensuring optimal performance in high-powered electronic systems.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance makes the diode suitable for a wide range of environments and applications.

Minimum Operating Temperature: -65 °C

Low minimum operating temperature allows for reliable performance in cold conditions, ideal for diverse operating environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and ensures a secure connection for optimal electrical conductivity.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and soldering orientations, enhancing versatility in circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature minimizes thermal stress on the diode during assembly, preserving its reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for efficient and quick soldering processes, enhancing manufacturing productivity.

Diode Type: RECTIFIER DIODE

Rectifier diode type is suitable for converting alternating current (AC) to direct current (DC), making it ideal for power supply applications.

Maximum Forward Voltage (VF): 1.53 V

Low maximum forward voltage ensures minimal power loss and efficient energy conversion in the diode.

Maximum Output Current: 4 A

High maximum output current capability enables the diode to handle heavy loads and power requirements consistently.

Terminal Form: C BEND

C bend terminal form simplifies the soldering process and ensures a secure connection, enhancing the diode's reliability.

Maximum Repetitive Peak Reverse Voltage: 800 V

High maximum repetitive peak reverse voltage rating provides reliable protection against reverse voltage spikes and ensures long-term durability.

Maximum Non Repetitive Peak Forward Current: 70 A

High maximum non-repetitive peak forward current capability allows the diode to handle short-term surge currents efficiently.

Diode Element Material: SILICON

Silicon diode element material offers high conductivity and reliability for optimal performance in electronic circuits.

Technical Specifications

Diodes & Rectifiers MURS480ET3G attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Application:

ULTRA FAST RECOVERY POWER

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.53 V

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

70 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-65 Cel

Maximum Output Current:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

800 V

Maximum Reverse Recovery Time:

.1 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MURS480ET3G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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