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MT9F002I12STCVH-GEVB

Onsemi

MT9F002I12STCVH-GEVB by Onsemi

MT9F002I12STCVH-GEVB by Onsemi is an Image Sensor Evaluation Board with the MT9F002 IC. It comes in Bulk packaging and has Moisture Sensitivity Level of 1. Ideal for testing and evaluating image sensor performance in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,587 parts In-Stock

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2,587

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Digiode

USA . 1,245 parts In-Stock

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1,245

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Distributors (Availability)

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AZTECH Wire

Italy . 94 parts In-Stock

1+ parts

$12.640

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94

$12.640

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TANS Electronics

Latvia . 6,874 parts In-Stock

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6,874

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Problanco Electronics

Mexico . 4,660 parts In-Stock

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4,660

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Kulean Microsystems

USA . 3,276 parts In-Stock

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3,276

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SupplyDigital Components

Austria . 2,032 parts In-Stock

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2,032

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Corphita

USA . 893 parts In-Stock

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893

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UHIMA Technologies

Türkiye . 479 parts In-Stock

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479

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Corohmni

South Africa . 348 parts In-Stock

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348

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Overview

Unlock the potential of cutting-edge imaging technology with the MT9F002I12STCVH-GEVB from Onsemi. Renowned for their commitment to quality and innovation, Onsemi provides a powerful platform for developing advanced applications in automotive, industrial, and consumer sectors. This versatile evaluation board simplifies design processes, empowering engineers to enhance image capture solutions effortlessly while ensuring reliability and superior performance. Experience excellence in every pixel!

Feature Benefit Bullets

Category: Development Boards, Kits, Programmers / Evaluation Boards

This category encompasses a wide range of development tools, making it suitable for various applications and providing flexibility for developers.

Sensor Evaluation Boards

Designed specifically for evaluating sensor performance, these boards offer a tailored experience for optimizing image sensor functionalities.

Packaging: Bulk

Bulk packaging is cost-effective and ideal for organizations looking to purchase multiple units for larger projects or research.

Sensor Type: Image Sensor

The image sensor type indicates high-quality visual data capture, making it ideal for applications in photography, videography, and surveillance.

Supplied Contents: Board(s)

Included boards provide everything necessary for immediate experimentation and development with the image sensor.

Utilized IC / Part: MT9F002

The MT9F002 part is well-regarded for its performance characteristics, ensuring reliable and high-quality image capture in various applications.

Base Product Number: MT9F002

Having a clear product number facilitates easy identification and ordering, ensuring users get the exact component they need for their projects.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

An MSL of 1 indicates that the product can be stored and handled freely without stringent moisture control measures, simplifying inventory management.

Technical Specifications

Additional Parts MT9F002I12STCVH-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Packaging:

Bulk

Utilized IC / Part:

MT9F002

Standard Package:

1

Base Product Number:

MT9F002

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

MT9F002I12STCVH-GEVB Miscellaneous Components trade compliance attributes, and parameters.

HTS

0000.00.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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