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MT9F002I12-N4000H-GEVB

Onsemi

MT9F002I12-N4000H-GEVB by Onsemi

Limited Part Number Data;

Median Price

$299.592

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$299.592

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$299.592

-

-

-

Vyrian

USA . 2,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,921

-

-

-

-

Digiode

USA . 1,210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,210

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 345 parts In-Stock

1+ parts

$5.151

100+ parts

-

1k+ parts

-

10k+ parts

-

345

$5.151

-

-

-

Ampacity Inc.

Singapore . 428 parts In-Stock

1+ parts

$21.100

100+ parts

-

1k+ parts

-

10k+ parts

-

428

$21.100

-

-

-

Component Stockers USA

USA . 700 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$99.990

-

-

-

Corohmni

South Africa . 148 parts In-Stock

1+ parts

$293.601

100+ parts

-

1k+ parts

-

10k+ parts

-

148

$293.601

-

-

-

Continental Prestige Electronics

USA . 4,749 parts In-Stock

1+ parts

$299.592

100+ parts

-

1k+ parts

-

10k+ parts

$293.601

4,749

$299.592

-

-

$293.601

Netroflash

USA . 100 parts In-Stock

1+ parts

$299.592

100+ parts

-

1k+ parts

$284.613

10k+ parts

$278.621

100

$299.592

-

$284.613

$278.621

TANS Electronics

Latvia . 7,413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,413

-

-

-

-

Kulean Microsystems

USA . 5,274 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,274

-

-

-

-

Argo Parts USA

USA . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,790

-

-

-

-

Problanco Electronics

Mexico . 1,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,902

-

-

-

-

Corphita

USA . 1,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,790

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

SupplyDigital Components

Austria . 691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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691

-

-

-

-

UHIMA Technologies

Türkiye . 407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

407

-

-

-

-

Technical Specifications

Additional Parts MT9F002I12-N4000H-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Utilized IC / Part:

MT9F002

Package:

Bulk

Standard Package:

1

Base Product Number:

MT9F002

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

MT9F002I12-N4000H-GEVB Miscellaneous Components trade compliance attributes, and parameters.

HTS

0000.00.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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