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MOC8021SR2M

Onsemi

MOC8021SR2M by Onsemi

The Onsemi MOC8021SR2M is a single optocoupler with a Darlington output, ideal for applications requiring high isolation voltage of 4170V. With a min C-E breakdown voltage of 50V and max forward current of 0.06A, it operates b/w -40 to 100°C. Suitable for surface mounting, it offers a min current transfer ratio of 1000% and max power dissipation of 0.15W.

Median Price

$0.375

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 5,000 parts In-Stock

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$0.375

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$0.375

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$0.375

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5,000

$0.375

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Distributors (In-Stock)

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Digiode

USA . 1,430 parts In-Stock

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$0.356

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1,430

$0.356

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Nova Conductors

Japan . 100 parts In-Stock

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$0.380

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100

$0.380

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Vyrian

USA . 4,945 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 698 parts In-Stock

1+ parts

$0.276

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698

$0.276

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Ampacity Inc.

Singapore . 4,803 parts In-Stock

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$0.319

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$0.319

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Corphita

USA . 1,453 parts In-Stock

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$0.338

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1,453

$0.338

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Corohmni

South Africa . 345 parts In-Stock

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$0.372

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345

$0.372

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$0.375

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$0.375

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Argo Parts USA

USA . 4,100 parts In-Stock

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$0.380

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$0.369

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$0.380

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$0.369

Continental Prestige Electronics

USA . 3,770 parts In-Stock

1+ parts

$0.380

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$0.372

3,770

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$0.372

Netroflash

USA . 500 parts In-Stock

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$0.380

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500

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Metaverse IC Inc.

Canada . 11,981 parts In-Stock

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TANS Electronics

Latvia . 7,427 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,199 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,278 parts In-Stock

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Problanco Electronics

Mexico . 3,367 parts In-Stock

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Supply Digital

USA . 1,959 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Kulean Microsystems

USA . 510 parts In-Stock

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510

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UHIMA Technologies

Türkiye . 297 parts In-Stock

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SupplyDigital Components

Austria . 180 parts In-Stock

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Overview

Discover the superior quality and reliability of the MOC8021SR2M by Onsemi, a leading manufacturer in the industry. As a top-of-the-line optocoupler with transistor outputs, this product is designed for a wide range of applications, offering seamless integration and exceptional performance. Providing customers with unmatched value, benefits, and advantages, the MOC8021SR2M ensures optimal functionality and efficiency in any project or application. Experience the difference with Onsemi's innovative technology and elevate your next project to new heights.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to integrate into systems with limited space.

Maximum Forward Current: 0.06 A

Can handle high forward current, making it reliable for various applications.

Optoelectronic Type: DARLINGTON OUTPUT OPTOCOUPLER

Darlington output optocoupler provides high current transfer ratio and low power dissipation.

Maximum Operating Temperature: 100 °C

Can operate in high temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments without issues.

Maximum Power Dissipation: 0.15 W

Low power dissipation helps in reducing heat generation and energy consumption.

Minimum Current Transfer Ratio: 1000 %

High current transfer ratio ensures efficient signal transmission.

Maximum Dark Current: 1000 nA

Low dark current ensures accurate signal detection even in low light conditions.

Packing Method: TR

TR packing method provides convenient packaging for easy handling and storage.

Minimum Collector-emitter Breakdown Voltage: 50 V

High collector-emitter breakdown voltage ensures protection against voltage spikes.

Maximum Isolation Voltage: 4170 V

High isolation voltage provides safety and protection against electric shock.

Mounting Feature: SURFACE MOUNT

Surface mount feature allows for easy and secure installation on PCBs.

Maximum Forward Voltage: 2 V

Low forward voltage reduces power consumption and heat generation.

Maximum On State Current: 0.15 A

Can handle high on-state current, making it suitable for various applications.

Technical Specifications

Optocoupler Transistor Outputs MOC8021SR2M attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Minimum Collector-emitter Breakdown Voltage:

50 V

Configuration:

SINGLE

Minimum Current Transfer Ratio:

1000 %

Maximum Dark Current:

1000 nA

Maximum Forward Current:

.06 A

Maximum Forward Voltage:

2 V

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.15 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Maximum Power Dissipation:

.15 W

Trade Compliance

MOC8021SR2M Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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