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MOC3162TVM

Onsemi

MOC3162TVM by Onsemi

The Onsemi MOC3162TVM is a single TRIAC output optocoupler with 3V max on-state voltage and 1A peak surge current. It operates b/w -40 to 85 °C, with 600V repetitive off-state voltage. Ideal for triggering devices in applications requiring high isolation voltage up to 4170V.

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2

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Digiode

USA . 2,117 parts In-Stock

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Vyrian

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Component Stockers USA

USA . 318 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 6,413 parts In-Stock

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SupplyDigital Components

Austria . 5,722 parts In-Stock

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Kulean Microsystems

USA . 4,958 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,248 parts In-Stock

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Supply Digital

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Problanco Electronics

Mexico . 1,877 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Corphita

USA . 1,576 parts In-Stock

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Corohmni

South Africa . 478 parts In-Stock

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UHIMA Technologies

Türkiye . 325 parts In-Stock

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Overview

Discover the superior performance and reliability of the MOC3162TVM by Onsemi, a leading manufacturer in the industry. As a top-of-the-line optocoupler trigger device output, this product offers unparalleled quality and precision. Ideal for a wide range of applications, this optoelectronic marvel boasts a peak surge current of 1A and a maximum on-state voltage of 3V. With its single configuration and zero cross-voltage capability, the MOC3162TVM provides exceptional value and benefits to customers seeking top-notch performance in their electronic devices. Trust Onsemi to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on state voltage results in efficient and reliable operation of the optocoupler.

Configuration: SINGLE

Single configuration simplifies the setup and integration of the optocoupler.

Peak Surge Current: 1 A

High peak surge current capability provides protection against sudden spikes in current.

Maximum Forward Current: 0.06 A

Sufficient forward current for reliable performance of the optocoupler.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER WITH ZERO CRSVR

Triac output type with zero cross over helps in precise switching and control of connected devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the optocoupler to be used in various environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature ensures reliable operation in extreme conditions.

Maximum Input Trigger Current: 0.01 A

Low input trigger current helps in efficient triggering of the optocoupler.

Repetitive Off-state Voltage (Peak): 600 V

High off-state voltage rating provides safety and protection against voltage surges.

Packing Method: TUBE

Tube packing method ensures safe transportation and storage of the optocoupler.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current minimizes power loss and enhances efficiency.

Minimum Peak Off-state Voltage: 600 V

High peak off-state voltage rating ensures reliable isolation between input and output.

Maximum Isolation Voltage: 4170 V

High isolation voltage rating ensures safety and protection of connected devices.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides easy and secure installation of the optocoupler.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3162TVM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.01 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

600 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3162TVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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