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MOC3071SVM

Onsemi

MOC3071SVM by Onsemi

The Onsemi MOC3071SVM is a single TRIAC output optocoupler with a max on-state voltage of 2.5V and peak surge current of 1A. It operates b/w -40 to 85 °C, has an isolation voltage of 4170V, and is suitable for triggering devices in various applications like motor controls and solid-state relays.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,023 parts In-Stock

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Digiode

USA . 202 parts In-Stock

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TANS Electronics

Latvia . 7,976 parts In-Stock

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Kulean Microsystems

USA . 7,851 parts In-Stock

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SupplyDigital Components

Austria . 3,159 parts In-Stock

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Problanco Electronics

Mexico . 3,122 parts In-Stock

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Corphita

USA . 1,279 parts In-Stock

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Corohmni

South Africa . 314 parts In-Stock

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UHIMA Technologies

Türkiye . 204 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the MOC3071SVM by Onsemi. As a leader in optocoupler technology, Onsemi delivers top-quality products that are reliable and efficient. The MOC3071SVM is perfect for a wide range of applications, offering a peak surge current of 1A and maximum isolation voltage of 4170V. With its single configuration and TRIAC output optocoupler, this product provides exceptional value and benefits to customers seeking high-performance components for their projects. Upgrade your electronics with the MOC3071SVM and experience unmatched quality and reliability.

Feature Benefit Bullets

Maximum On State Voltage: 2.5 V

Low voltage drop ensures efficient operation and power savings.

Configuration: SINGLE

Simplifies installation and allows for easy integration into existing systems.

Peak Surge Current: 1 A

Capability to handle short surges in current, providing reliability under transient conditions.

Maximum Forward Current: 0.06 A

Suitable for low to moderate current applications, ensuring safe operation.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output provides compatibility with a variety of devices and control options.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in diverse environments.

Minimum Operating Temperature: -40 °C

Operates reliably in cold conditions, expanding usage scenarios.

Maximum Input Trigger Current: 0.015 A

Low trigger current requirement for activation, promoting efficiency.

Repetitive Off-state Voltage (Peak): 800 V

High off-state voltage rating ensures safe and reliable isolation.

Packing Method: TUBE

Protective tube packaging facilitates handling and storage.

Maximum Reverse Leakage Current: 0.0001 A

Minimal leakage current for enhanced safety and energy efficiency.

Maximum Isolation Voltage: 4170 V

High isolation voltage provides robust protection against electrical hazards.

Mounting Feature: SURFACE MOUNT

Surface mount design offers easy and secure installation on circuit boards.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3071SVM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.015 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

2.5 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

800 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3071SVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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