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MOC3071SR2M

Onsemi

MOC3071SR2M by Onsemi

The Onsemi MOC3071SR2M is a TRIAC output optocoupler with a max on-state voltage of 2.5V and peak surge current of 1A. It operates b/w -40 to 85 °C, has an isolation voltage of 4170V, and is ideal for triggering devices in applications requiring high voltage protection.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Problanco Electronics

Mexico . 4,456 parts In-Stock

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SupplyDigital Components

Austria . 3,093 parts In-Stock

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Corphita

USA . 1,948 parts In-Stock

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Kulean Microsystems

USA . 1,068 parts In-Stock

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TANS Electronics

Latvia . 900 parts In-Stock

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Corohmni

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UHIMA Technologies

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Overview

Looking for a reliable and high-quality optocoupler trigger device output? Look no further than the MOC3071SR2M by Onsemi. With a peak surge current of 1A and a maximum isolation voltage of 4170V, this TRIAC output optocoupler offers unmatched performance and durability. Ideal for a wide range of applications, this product provides customers with peace of mind knowing they are investing in a top-notch solution. Upgrade your electronics today with the MOC3071SR2M and experience the benefits firsthand.

Feature Benefit Bullets

Maximum On State Voltage: 2.5 V

Low on-state voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Configuration: SINGLE

Single configuration simplifies the setup and installation process, making it user-friendly.

Peak Surge Current: 1 A

High surge current capability ensures reliable operation even during transient voltage spikes.

Maximum Forward Current: 0.06 A

Sufficient forward current rating allows for proper functioning of the optocoupler without overloading.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output design enables reliable switching of AC loads, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures stable performance under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures makes the product suitable for use in extreme cold environments.

Maximum Input Trigger Current: 0.015 A

Low trigger current requirement ensures efficient operation and compatibility with various control circuits.

Repetitive Off-state Voltage (Peak): 800 V

High off-state voltage capability provides reliable isolation and protection against voltage transients.

Packing Method: TR

TR packing method is suitable for automated assembly processes, ensuring ease of production.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current helps in maintaining signal integrity and preventing unintended trigger signals.

Maximum Isolation Voltage: 4170 V

High isolation voltage rating ensures safety and protection against high voltage breakdowns.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for compact and space-saving installation on PCBs.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3071SR2M attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.015 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

2.5 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

800 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3071SR2M Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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