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MOC3033TVM

Onsemi

MOC3033TVM by Onsemi

MOC3033TVM by Onsemi is a single TRIAC output optocoupler with 3V max on-state voltage and 1A peak surge current. It operates b/w -40 to 85 °C, has 250V repetitive off-state voltage, and offers 4170V isolation. Ideal for triggering devices in applications requiring high isolation levels and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,763 parts In-Stock

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Vyrian

USA . 2,235 parts In-Stock

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Component Stockers USA

USA . 735 parts In-Stock

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$99.990

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735

$99.990

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Kulean Microsystems

USA . 6,105 parts In-Stock

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TANS Electronics

Latvia . 4,330 parts In-Stock

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SupplyDigital Components

Austria . 2,463 parts In-Stock

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Problanco Electronics

Mexico . 2,443 parts In-Stock

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Supply Digital

USA . 1,920 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Corphita

USA . 710 parts In-Stock

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Corohmni

South Africa . 321 parts In-Stock

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UHIMA Technologies

Türkiye . 10 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the MOC3033TVM by Onsemi. Known for their superior quality and reliability, Onsemi's optocoupler trigger devices are essential components for a wide range of applications. Whether you're working on industrial controls, motor drives, or lighting systems, this product offers unmatched value and performance. Trust in Onsemi to provide the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low maximum on state voltage helps in reducing power consumption and heat dissipation, making the product energy efficient.

Configuration: SINGLE

Single configuration simplifies the design and integration process, making it easier to use in various applications.

Peak Surge Current: 1 A

High peak surge current capability ensures reliable operation under transient conditions, improving the product's robustness.

Maximum Forward Current: 0.06 A

With a low forward current rating, the product can be used in low-power applications while maintaining efficiency.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER WITH ZERO CRSVR

The optoelectronic type ensures precise control over the output signal while zero cross voltage removes the risk of false triggering, making it suitable for sensitive applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the product to be used in various environments without the risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the product to function reliably even in extreme cold conditions.

Maximum Input Trigger Current: 0.005 A

Low input trigger current ensures efficient operation with minimal power consumption.

Repetitive Off-state Voltage (Peak): 250 V

High off-state voltage rating ensures secure isolation between input and output, enhancing safety and reliability.

Packing Method: TUBE

Tube packing method provides protection during transportation and storage, reducing the risk of damage.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current minimizes power loss and enhances energy efficiency of the product.

Minimum Peak Off-state Voltage: 250 V

High peak off-state voltage rating ensures reliable isolation between input and output circuits, improving safety.

Maximum Isolation Voltage: 4170 V

High isolation voltage rating provides reliable protection against voltage surges and electrical shocks, ensuring safety in high voltage applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature simplifies the installation process and provides secure mechanical support, making it suitable for various mounting configurations.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3033TVM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED, VDE APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

250 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3033TVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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