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MOC3033SM

Onsemi

MOC3033SM by Onsemi

TRIAC OUTPUT OPTOCOUPLER WITH ZERO CRSVR; Mounting Feature: SURFACE MOUNT; Terminal Finish: TIN; Maximum On State Current: .1 A; Minimum Peak Off-state Voltage: 250 V; JESD-609 Code: e3;

Median Price

$0.438

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2 parts In-Stock

1+ parts

$0.316

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2

$0.316

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DigiKey

USA . 2,431 parts In-Stock

1+ parts

$1.060

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$0.548

1k+ parts

$0.435

10k+ parts

$0.369

2,431

$1.060

$0.548

$0.435

$0.369

Mouser Electronics

USA . 1,831 parts In-Stock

1+ parts

$1.090

100+ parts

$0.549

1k+ parts

$0.435

10k+ parts

$0.385

1,831

$1.090

$0.549

$0.435

$0.385

Flip Electronics (Authorized)

USA . 21,995 parts In-Stock

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Verical

USA . 7,000 parts In-Stock

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$0.438

10k+ parts

$0.391

7,000

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$0.438

$0.391

Rochester

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$0.422

1k+ parts

$0.351

10k+ parts

$0.313

7,000

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$0.422

$0.351

$0.313

Chip1Stop

Japan . 2 parts In-Stock

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Freelance Electronics

USA . 10 parts In-Stock

1+ parts

$0.264

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$0.264

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Digiode

USA . 2,476 parts In-Stock

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$0.300

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$0.300

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Vyrian

USA . 671 parts In-Stock

1+ parts

$0.304

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671

$0.304

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Mobius Materials

USA . 631 parts In-Stock

1+ parts

$0.887

100+ parts

$0.711

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631

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Flip Electronics

USA . 14,995 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,463 parts In-Stock

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Electronics Depot

USA . 40 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 122 parts In-Stock

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$0.264

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Corphita

USA . 2,441 parts In-Stock

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$0.284

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Andel Nordic

Denmark . 3,548 parts In-Stock

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$3.955

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$3.797

10k+ parts

$3.797

3,548

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$3.797

$3.797

QUARKTWIN TECHNOLOGY LTD

USA . 29,711 parts In-Stock

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Perfect Parts

USA . 28,538 parts In-Stock

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Kulean Microsystems

USA . 6,814 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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$0.654

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Supply Digital

USA . 2,700 parts In-Stock

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SupplyDigital Components

Austria . 2,098 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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TANS Electronics

Latvia . 1,151 parts In-Stock

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Problanco Electronics

Mexico . 810 parts In-Stock

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UHIMA Technologies

Türkiye . 416 parts In-Stock

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416

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Technical Specifications

Optocoupler Trigger Device Outputs MOC3033SM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Nominal Input Trigger Current:

5 mA

Maximum Isolation Voltage:

7500 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.1 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Peak Off-state Voltage:

250 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Sub-Category:

Optocoupler - Trigger Device Outputs

Terminal Finish:

TIN

Trade Compliance

MOC3033SM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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