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MOC3010M

Onsemi

MOC3010M by Onsemi

The Onsemi MOC3010M is a single TRIAC output optocoupler with a max on-state voltage of 3V and peak surge current of 1A. It operates b/w -40 to 85°C, has an isolation voltage of 5300V, and is ideal for triggering devices in applications requiring high electrical isolation.

Median Price

$0.243

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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Rochester

USA . 500 parts In-Stock

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$0.243

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$0.229

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$0.207

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$0.243

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Farnell

UK . 953 parts In-Stock

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$0.547

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$0.292

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Newark

USA . 752 parts In-Stock

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$0.692

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$0.413

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$0.327

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$0.281

752

$0.692

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Mouser Electronics

USA . 497 parts In-Stock

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$0.770

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$0.416

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Arrow

USA . 3,900 parts In-Stock

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$0.237

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$0.210

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Verical

USA . 2,000 parts In-Stock

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Adafruit Industries

USA . 1,940 parts In-Stock

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Chip1Stop

Japan . 489 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,413 parts In-Stock

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Vyrian

USA . 2,229 parts In-Stock

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Flip Electronics

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Electro Sonic

Canada . 3,000 parts In-Stock

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$0.274

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$0.262

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$0.231

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$0.231

NAC Semi

USA . 2,000 parts In-Stock

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$0.918

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$0.835

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$0.835

Cyclops Electronics Ltd

UK . 1,758 parts In-Stock

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Goldney Electronics S.L.

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ComSIT Distribution GmbH

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300

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ComSIT USA

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300

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Chip Stock

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Vectronix, Inc

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A2Z Electronics, Inc.

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Prism Electronics

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LWI Electronics Inc

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Atlantic Semiconductor

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Bristol Electronics

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Corphita

USA . 2,146 parts In-Stock

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$0.189

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Corohmni

South Africa . 169 parts In-Stock

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Metaverse IC Inc.

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Lixinc

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SupplyDigital Components

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Problanco Electronics

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 2,303 parts In-Stock

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Eastek

USA . 2,000 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Infinite Electronics LLP (Excess)

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Supply Digital

USA . 870 parts In-Stock

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TANS Electronics

Latvia . 707 parts In-Stock

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UHIMA Technologies

Türkiye . 319 parts In-Stock

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Overview

Discover the versatile MOC3010M by Onsemi, a top-tier optocoupler trigger device output that offers unparalleled quality and reliability. Manufactured by Onsemi, a leader in semiconductor technology, this product is designed to meet the highest standards of performance. Ideal for a wide range of applications, this optocoupler provides seamless isolation and triggering capabilities. With its peak surge current of 1A and maximum operating temperature of 85°C, the MOC3010M ensures optimal functionality in diverse environments. Experience the value and benefits of this innovative product, offering customers a dependable solution for their electronic needs.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low maximum on state voltage ensures efficient performance and reduces power consumption.

Configuration: SINGLE

Single configuration simplifies installation and integration with other components.

Peak Surge Current: 1 A

High peak surge current capability allows the device to handle sudden spikes in current, ensuring reliability in unpredictable conditions.

Maximum Forward Current: 0.06 A

Low maximum forward current helps in preventing overheating and extends the lifespan of the device.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler provides reliable switching capabilities, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the device can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the device to function effectively in cold environments.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and corrosion resistance, enhancing the overall reliability of the product.

Maximum Input Trigger Current: 0.015 A

Low maximum input trigger current ensures efficient triggering and reduces power consumption.

Repetitive Off-state Voltage (Peak): 250 V

High repetitive off-state voltage rating ensures reliable performance and safety during off-state conditions.

Nominal Input Trigger Current: 15 mA

Nominal input trigger current provides a balance between sensitivity and reliability in triggering the device.

Maximum Reverse Leakage Current: 0.0001 A

Low maximum reverse leakage current helps in maintaining the integrity of the signal and prevents unwanted current flow.

Minimum Peak Off-state Voltage: 250 V

High minimum peak off-state voltage ensures the device can effectively block voltage during off-state conditions.

Maximum Isolation Voltage: 5300 V

High maximum isolation voltage provides electrical safety and protection against high voltage spikes or transients.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature offers secure and stable installation, making it suitable for rugged environments.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3010M attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.015 A

Nominal Input Trigger Current:

15 mA

Maximum Isolation Voltage:

5300 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Minimum Peak Off-state Voltage:

250 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Sub-Category:

Optocoupler - Trigger Device Outputs

Terminal Finish:

TIN

Trade Compliance

MOC3010M Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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