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ML4824IP1

Onsemi

ML4824IP1 by Onsemi

ML4824IP1 by Onsemi is a switching regulator with 16 terminals, operating b/w -40 to 85 °C. It features pulse width modulation control mode and boost switcher configuration. Ideal for industrial applications requiring power factor control and post regulation in a compact IN-LINE package.

Median Price

$14.940

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 10 parts In-Stock

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Chip Stock

USA . 58,000 parts In-Stock

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Digiode

USA . 2,415 parts In-Stock

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Vyrian

USA . 2,392 parts In-Stock

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ComSIT Distribution GmbH

Germany . 87 parts In-Stock

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Prism Electronics

USA . 51 parts In-Stock

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DF Sales Co.

USA . 18 parts In-Stock

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DF Sales Co.

USA . 18 parts In-Stock

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Cyclops Electronics Ltd

UK . 16 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 322 parts In-Stock

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Perfect Parts

USA . 11,760 parts In-Stock

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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Microchip USA

USA . 7,271 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,515 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,448 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 1,925 parts In-Stock

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Glotronic Ltd.

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GreenTree Electronics

Israel . 1,800 parts In-Stock

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Supply Digital

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Corphita

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TANS Electronics

Latvia . 777 parts In-Stock

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SupplyDigital Components

Austria . 707 parts In-Stock

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Kulean Microsystems

USA . 461 parts In-Stock

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UHIMA Technologies

Türkiye . 211 parts In-Stock

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Assy Fe

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Overview

Enhance your power management systems with the ML4824IP1 by Onsemi, a top-of-the-line switching regulator and controller that guarantees superior performance and reliability. Onsemi's reputation for innovation and quality shines through in this product, offering customers unmatched value and benefits. Ideal for a wide range of applications, this power factor controller with post regulator is designed to optimize efficiency and boost overall system performance. Upgrade your power solutions today with the ML4824IP1 from Onsemi and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and reliability, making this product suitable for long-term use.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures stable performance even in elevated temperature environments.

Control Mode: CURRENT/VOLTAGE-MODE

The current/voltage-mode control allows for precise regulation of output, ensuring efficient power management and performance optimization.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can withstand cold temperature conditions, making it suitable for a variety of environments.

Maximum Seated Height: 4.32 mm

The compact maximum seated height of 4.32 mm enables space-saving installation, making this product ideal for applications with limited space.

Control Technique: PULSE WIDTH MODULATION

The use of pulse width modulation as the control technique allows for efficient power conversion and regulation, resulting in improved energy efficiency.

Switcher Config: BOOST

The boost switcher configuration enables step-up voltage conversion, making this product suitable for applications requiring higher output voltages.

Technical Specifications

Switching Regulators & Controllers ML4824IP1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

R-PDIP-T16

Length:

19.05 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

4.32 mm

Surface Mount:

NO

Switcher Config:

BOOST

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

ML4824IP1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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