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ML4824CS1

Onsemi

ML4824CS1 by Onsemi

ML4824CS1 by Onsemi is a switching regulator with boost configuration. It operates b/w 0-70°C, using pulse width modulation for current/voltage control. Ideal for power factor correction and post-regulation in commercial applications.

Median Price

$8.546

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 250 parts In-Stock

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$2.093

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American Microsemiconductor Inc.

USA . 26 parts In-Stock

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$15.000

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Chip Stock

USA . 49,000 parts In-Stock

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Vyrian

USA . 634 parts In-Stock

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Digiode

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Fibra_Brandt Electronic GMBH

Germany . 25 parts In-Stock

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ECAB

Sweden . 4 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 200 parts In-Stock

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$2.051

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Argo Parts USA

USA . 6,658 parts In-Stock

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$2.093

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Continental Prestige Electronics

USA . 6,496 parts In-Stock

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$2.093

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$2.051

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Netroflash

USA . 1,050 parts In-Stock

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$2.093

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$1.988

10k+ parts

$1.946

1,050

$2.093

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$1.988

$1.946

Andel Nordic

Denmark . 1,936 parts In-Stock

1+ parts

$2.838

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$2.725

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$2.725

1,936

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$2.725

Ampacity Inc.

Singapore . 1,402 parts In-Stock

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$3.500

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$3.500

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Semicontronic

India . 1,468 parts In-Stock

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$4.500

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$4.388

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$4.365

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$4.500

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Aztec Data Supply Inc.

USA . 2,254 parts In-Stock

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$10.129

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AZTECH Wire

Italy . 1,480 parts In-Stock

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$13.305

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Component Stockers USA

USA . 373 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 6,329 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,700 parts In-Stock

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Kulean Microsystems

USA . 5,568 parts In-Stock

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Microchip USA

USA . 4,710 parts In-Stock

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Problanco Electronics

Mexico . 2,794 parts In-Stock

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Corphita

USA . 1,981 parts In-Stock

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Supply Digital

USA . 1,339 parts In-Stock

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TANS Electronics

Latvia . 1,330 parts In-Stock

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UHIMA Technologies

Türkiye . 780 parts In-Stock

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Kepictronics

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Perfect Parts

USA . 24 parts In-Stock

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Overview

Experience superior power management with the Onsemi ML4824CS1 switching regulator and controller. Built by a trusted manufacturer known for quality and reliability, this product offers unmatched efficiency and performance. Ideal for a wide range of applications, this versatile device provides customers with a cost-effective solution for their power regulation needs. Upgrade your system today with the ML4824CS1 and enjoy the benefits of precise control and optimal power delivery.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the material for the package body makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy assembly and installation, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to design the layout on a circuit board, optimizing space utilization and providing a compact overall product size.

No. of Terminals: 16

With a higher number of terminals, the product offers increased connectivity options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for applications where board real estate is limited.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand demanding environmental conditions, providing reliable performance under stress.

Control Mode: CURRENT/VOLTAGE-MODE

The ability to operate in both current and voltage modes allows for versatile control options, enabling customization based on specific application requirements.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in a wide range of environments, making it suitable for various applications.

Terminal Position: DUAL

Dual terminal positions offer redundancy and enhanced connectivity options, increasing the product's versatility and reliability.

Maximum Seated Height: 2.72 mm

The low seated height makes the product suitable for applications where space constraints are a concern, allowing for more compact designs.

Width (mm): 7.52 mm

The small width of the product makes it easy to integrate into tight spaces or densely populated PCB layouts, enabling efficient use of available board space.

Other IC type: POWER FACTOR CONTROLLER WITH POST REGULATOR

This integrated circuit type offers advanced functionality for power management, contributing to improved efficiency and performance of the product.

Length: 10.34 mm

The moderate length of the product provides a balance between compact size and ease of handling during assembly and installation.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades means the product is suitable for typical operating conditions, making it a cost-effective choice for many applications.

Terminal Form: GULL WING

The gull-wing terminal form offers secure electrical connections and is well-suited for automated assembly processes, ensuring reliability and ease of manufacturing.

Control Technique: PULSE WIDTH MODULATION

The use of pulse width modulation for control technique allows for precise regulation of output voltage, contributing to stable performance and efficient power conversion.

Switcher Config: BOOST

The boost switcher configuration is ideal for applications requiring higher output voltage than the input, offering flexibility in voltage conversion capabilities.

Terminal Pitch: 1.27 mm

The small terminal pitch facilitates high-density mounting, enabling more compact and efficient PCB designs while maintaining electrical connectivity.

Technical Specifications

Switching Regulators & Controllers ML4824CS1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

R-PDSO-G16

Length:

10.34 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.72 mm

Surface Mount:

YES

Switcher Config:

BOOST

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.52 mm

Trade Compliance

ML4824CS1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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